POLISHING PAD AND POLISHING METHOD

To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HISHIDA SHOTA, HASE EIJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHAMBERS PROVIDED WITH MANIPULATION DEVICES DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HAND TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANIPULATORS PERFORMING OPERATIONS POLISHING PORTABLE POWER-DRIVEN TOOLS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	HISHIDA SHOTA HASE EIJI
description	To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130, a ratio (Sm/Sk) of the total area Sm(cm2) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.30 or more and 0.80 or less, and a ratio (Vm/Sk) of the total volume Vm(cm3) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.07 or more.SELECTED DRAWING: Figure 1 【課題】研磨能率を維持しつつ、目詰まりの発生が抑制された研磨パッドを提供する。【解決手段】研磨パッド１１０は、研磨面１３０に溝部１３１が形成された研磨層１４０を備え、研磨面１３０に対して垂直方向から見た場合に、研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全面積Ｓm（ｃｍ2）の比（Ｓm／Ｓk）が０．３０以上０．８０以下であり、且つ研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全容積Ｖm（ｃｍ3）の比（Ｖm／Ｓk）が０．０７以上である。【選択図】図１
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2022159076A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2022159076A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2022159076A3</originalsourceid><addsrcrecordid>eNrjZFAK8PfxDPbw9HNXCHB0UXD0c1FAiPi6hnj4u_AwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDIyNDU0sDczNHY6IUAQBuNCLE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING PAD AND POLISHING METHOD</title><source>esp@cenet</source><creator>HISHIDA SHOTA ; HASE EIJI</creator><creatorcontrib>HISHIDA SHOTA ; HASE EIJI</creatorcontrib><description>To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130, a ratio (Sm/Sk) of the total area Sm(cm2) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.30 or more and 0.80 or less, and a ratio (Vm/Sk) of the total volume Vm(cm3) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.07 or more.SELECTED DRAWING: Figure 1 【課題】研磨能率を維持しつつ、目詰まりの発生が抑制された研磨パッドを提供する。【解決手段】研磨パッド１１０は、研磨面１３０に溝部１３１が形成された研磨層１４０を備え、研磨面１３０に対して垂直方向から見た場合に、研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全面積Ｓm（ｃｍ2）の比（Ｓm／Ｓk）が０．３０以上０．８０以下であり、且つ研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全容積Ｖm（ｃｍ3）の比（Ｖm／Ｓk）が０．０７以上である。【選択図】図１</description><language>eng ; jpn</language><subject>CHAMBERS PROVIDED WITH MANIPULATION DEVICES ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HAND TOOLS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MANIPULATORS ; PERFORMING OPERATIONS ; POLISHING ; PORTABLE POWER-DRIVEN TOOLS ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221017&DB=EPODOC&CC=JP&NR=2022159076A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221017&DB=EPODOC&CC=JP&NR=2022159076A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HISHIDA SHOTA</creatorcontrib><creatorcontrib>HASE EIJI</creatorcontrib><title>POLISHING PAD AND POLISHING METHOD</title><description>To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130, a ratio (Sm/Sk) of the total area Sm(cm2) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.30 or more and 0.80 or less, and a ratio (Vm/Sk) of the total volume Vm(cm3) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.07 or more.SELECTED DRAWING: Figure 1 【課題】研磨能率を維持しつつ、目詰まりの発生が抑制された研磨パッドを提供する。【解決手段】研磨パッド１１０は、研磨面１３０に溝部１３１が形成された研磨層１４０を備え、研磨面１３０に対して垂直方向から見た場合に、研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全面積Ｓm（ｃｍ2）の比（Ｓm／Ｓk）が０．３０以上０．８０以下であり、且つ研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全容積Ｖm（ｃｍ3）の比（Ｖm／Ｓk）が０．０７以上である。【選択図】図１</description><subject>CHAMBERS PROVIDED WITH MANIPULATION DEVICES</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>HAND TOOLS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MANIPULATORS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>PORTABLE POWER-DRIVEN TOOLS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAK8PfxDPbw9HNXCHB0UXD0c1FAiPi6hnj4u_AwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDIyNDU0sDczNHY6IUAQBuNCLE</recordid><startdate>20221017</startdate><enddate>20221017</enddate><creator>HISHIDA SHOTA</creator><creator>HASE EIJI</creator><scope>EVB</scope></search><sort><creationdate>20221017</creationdate><title>POLISHING PAD AND POLISHING METHOD</title><author>HISHIDA SHOTA ; HASE EIJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022159076A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>CHAMBERS PROVIDED WITH MANIPULATION DEVICES</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>HAND TOOLS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MANIPULATORS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>PORTABLE POWER-DRIVEN TOOLS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HISHIDA SHOTA</creatorcontrib><creatorcontrib>HASE EIJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HISHIDA SHOTA</au><au>HASE EIJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD AND POLISHING METHOD</title><date>2022-10-17</date><risdate>2022</risdate><abstract>To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130, a ratio (Sm/Sk) of the total area Sm(cm2) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.30 or more and 0.80 or less, and a ratio (Vm/Sk) of the total volume Vm(cm3) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.07 or more.SELECTED DRAWING: Figure 1 【課題】研磨能率を維持しつつ、目詰まりの発生が抑制された研磨パッドを提供する。【解決手段】研磨パッド１１０は、研磨面１３０に溝部１３１が形成された研磨層１４０を備え、研磨面１３０に対して垂直方向から見た場合に、研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全面積Ｓm（ｃｍ2）の比（Ｓm／Ｓk）が０．３０以上０．８０以下であり、且つ研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全容積Ｖm（ｃｍ3）の比（Ｖm／Ｓk）が０．０７以上である。【選択図】図１</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; jpn
recordid	cdi_epo_espacenet_JP2022159076A
source	esp@cenet
subjects	CHAMBERS PROVIDED WITH MANIPULATION DEVICES DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HAND TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANIPULATORS PERFORMING OPERATIONS POLISHING PORTABLE POWER-DRIVEN TOOLS TRANSPORTING
title	POLISHING PAD AND POLISHING METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T22%3A57%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HISHIDA%20SHOTA&rft.date=2022-10-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2022159076A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true