POLISHING PAD AND POLISHING METHOD

To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130,...

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Bibliographische Detailangaben
Hauptverfasser:	HISHIDA SHOTA, HASE EIJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHAMBERS PROVIDED WITH MANIPULATION DEVICES DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HAND TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANIPULATORS PERFORMING OPERATIONS POLISHING PORTABLE POWER-DRIVEN TOOLS TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing pad which suppresses generation of clogging while maintaining polishing efficiency.SOLUTION: A polishing pad 110 includes a polishing layer 140 having a groove part 131 formed in a polished surface 130, wherein when viewed from a direction vertical to the polished surface 130, a ratio (Sm/Sk) of the total area Sm(cm2) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.30 or more and 0.80 or less, and a ratio (Vm/Sk) of the total volume Vm(cm3) of the groove part 131 to the total area Sk(cm2) of the polished surface 130 is 0.07 or more.SELECTED DRAWING: Figure 1 【課題】研磨能率を維持しつつ、目詰まりの発生が抑制された研磨パッドを提供する。【解決手段】研磨パッド１１０は、研磨面１３０に溝部１３１が形成された研磨層１４０を備え、研磨面１３０に対して垂直方向から見た場合に、研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全面積Ｓm（ｃｍ2）の比（Ｓm／Ｓk）が０．３０以上０．８０以下であり、且つ研磨面１３０の全面積Ｓk（ｃｍ2）に対する溝部１３１の全容積Ｖm（ｃｍ3）の比（Ｖm／Ｓk）が０．０７以上である。【選択図】図１