SENSOR ASSEMBLY AND MANUFACTURING METHOD THEREOF

SENSOR ASSEMBLY AND MANUFACTURING METHOD THEREOF

To provide a sensor assembly and a manufacturing method thereof that includes a sensor layer having translucency.SOLUTION: A sensor assembly 1 includes a translucent skin material 2, and a sensor layer 4 arranged on the back side of the skin material 2, and including an insulating layer 400, an elec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OKUMURA TAKEMASA, NONAKA TOSHIYA
Format: Patent
Sprache:eng ; jpn
Schlagworte:
BASIC ELECTRIC ELEMENTS
DETECTING MASSES OR OBJECTS
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
GEOPHYSICS
GRAVITATIONAL MEASUREMENTS
MEASURING
PHYSICS
RELAYS
SELECTORS
TESTING
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Beschreibung
Zusammenfassung:To provide a sensor assembly and a manufacturing method thereof that includes a sensor layer having translucency.SOLUTION: A sensor assembly 1 includes a translucent skin material 2, and a sensor layer 4 arranged on the back side of the skin material 2, and including an insulating layer 400, an electrode layer 401 arranged on at least one of the front side and the back side of the insulating layer 400, and a first through hole 42 penetrating through the insulating layer 400 and the electrode layer 401 in the front-back direction.SELECTED DRAWING: Figure 2 【課題】透光性を有するセンサ層を備えるセンサアセンブリおよびその製造方法を提供することを課題とする。【解決手段】センサアセンブリ１は、透光性を有する表皮材２と、表皮材２の裏側に配置され、絶縁層４００と、絶縁層４００の表側および裏側のうち少なくとも一方に配置される電極層４０１と、絶縁層４００および電極層４０１を表裏方向に貫通する第一貫通孔４２と、を有するセンサ層４と、を備える。【選択図】図２