FLUX AND SOLDER PASTE

To provide a solder paste which can suppress peeling from a joined object when stress due to warpage of a substrate is applied thereto, and can suppress joining failure, and a flux used in the solder paste.SOLUTION: A flux contains a base resin, an activator, a thixotropic agent, a solvent and a sol...

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Bibliographische Detailangaben
Hauptverfasser:	ASAMI AI, TAKAGI KAZUNOBU, NAGAI TOMOKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a solder paste which can suppress peeling from a joined object when stress due to warpage of a substrate is applied thereto, and can suppress joining failure, and a flux used in the solder paste.SOLUTION: A flux contains a base resin, an activator, a thixotropic agent, a solvent and a solder joint failure inhibitor, wherein the solder joint failure inhibitor can be produced by reacting a copolymer of olefin and/or a vinyl aromatic compound, and a maleic anhydride with specific alcohol.SELECTED DRAWING: None 【課題】基板の反り等による応力が加わっても、接合対象物から剥離することを抑制でき、よって接合不良を抑制できるソルダペースト、及びこのようなソルダペーストに用いるフラックスを提供する。【解決手段】ベース樹脂、活性剤、チクソ剤、溶剤、及びはんだ接合不良抑制剤を含み、前記はんだ接合不良抑制剤は、オレフィン及び／又はビニル芳香族化合物と無水マレイン酸との共重合体を特定のアルコールと反応させることにより製造することができる共重合体である。【選択図】なし