COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE
To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel pho...
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creator | TANIGUCHI MEGUMI OYAMA TAKAHARU TAKAMIZU YOSUKE |
description | To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel phosphorous plating layer is provided. This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. The content of the additive A is less than 0.1 wt.%.SELECTED DRAWING: None
【課題】Ni-P基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Aを含む。前記添加剤Aは、炭素数が4~12の炭化水素基、および1単位以上4単位以下のオキシエチレン単位を有する(ポリ)オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Aの含有量は0.1重量%未満である。【選択図】なし |
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【課題】Ni-P基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Aを含む。前記添加剤Aは、炭素数が4~12の炭化水素基、および1単位以上4単位以下のオキシエチレン単位を有する(ポリ)オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Aの含有量は0.1重量%未満である。【選択図】なし</description><language>eng ; jpn</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; INFORMATION STORAGE ; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; PHYSICS ; POLISHES ; POLISHING ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SEMICONDUCTOR DEVICES ; SKI WAXES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221014&DB=EPODOC&CC=JP&NR=2022155732A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221014&DB=EPODOC&CC=JP&NR=2022155732A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANIGUCHI MEGUMI</creatorcontrib><creatorcontrib>OYAMA TAKAHARU</creatorcontrib><creatorcontrib>TAKAMIZU YOSUKE</creatorcontrib><title>COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE</title><description>To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel phosphorous plating layer is provided. This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. The content of the additive A is less than 0.1 wt.%.SELECTED DRAWING: None
【課題】Ni-P基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Aを含む。前記添加剤Aは、炭素数が4~12の炭化水素基、および1単位以上4単位以下のオキシエチレン単位を有する(ポリ)オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Aの含有量は0.1重量%未満である。【選択図】なし</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>INFORMATION STORAGE</subject><subject>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>POLISHING</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SKI WAXES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB19vcN8A_2DPH091Nw8w9SCPD38Qz28PRzV3D0c1HwdfQLdXN0DgkNAon4uoZ4-Lso-LsBxd39XEM8nRVcPIO9FYJDnYJDghxDXHkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkZGhqam5sZGjMVGKAGFbLtc</recordid><startdate>20221014</startdate><enddate>20221014</enddate><creator>TANIGUCHI MEGUMI</creator><creator>OYAMA TAKAHARU</creator><creator>TAKAMIZU YOSUKE</creator><scope>EVB</scope></search><sort><creationdate>20221014</creationdate><title>COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE</title><author>TANIGUCHI MEGUMI ; OYAMA TAKAHARU ; TAKAMIZU YOSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022155732A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>INFORMATION STORAGE</topic><topic>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>POLISHING</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SKI WAXES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TANIGUCHI MEGUMI</creatorcontrib><creatorcontrib>OYAMA TAKAHARU</creatorcontrib><creatorcontrib>TAKAMIZU YOSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANIGUCHI MEGUMI</au><au>OYAMA TAKAHARU</au><au>TAKAMIZU YOSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE</title><date>2022-10-14</date><risdate>2022</risdate><abstract>To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel phosphorous plating layer is provided. This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. The content of the additive A is less than 0.1 wt.%.SELECTED DRAWING: None
【課題】Ni-P基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Aを含む。前記添加剤Aは、炭素数が4~12の炭化水素基、および1単位以上4単位以下のオキシエチレン単位を有する(ポリ)オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Aの含有量は0.1重量%未満である。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING |
title | COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE |
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