COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE

To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel pho...

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Hauptverfasser: TANIGUCHI MEGUMI, OYAMA TAKAHARU, TAKAMIZU YOSUKE
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creator TANIGUCHI MEGUMI
OYAMA TAKAHARU
TAKAMIZU YOSUKE
description To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel phosphorous plating layer is provided. This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. The content of the additive A is less than 0.1 wt.%.SELECTED DRAWING: None 【課題】Ni-P基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Aを含む。前記添加剤Aは、炭素数が4~12の炭化水素基、および1単位以上4単位以下のオキシエチレン単位を有する(ポリ)オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Aの含有量は0.1重量%未満である。【選択図】なし
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This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. 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This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. The content of the additive A is less than 0.1 wt.%.SELECTED DRAWING: None 【課題】Ni-P基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Aを含む。前記添加剤Aは、炭素数が4~12の炭化水素基、および1単位以上4単位以下のオキシエチレン単位を有する(ポリ)オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Aの含有量は0.1重量%未満である。【選択図】なし</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
PHYSICS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
TRANSPORTING
title COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE
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