COMPOSITION FOR POLISHING AND MANUFACTURING METHOD OF MAGNETIC DISK SUBSTRATE

To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel pho...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TANIGUCHI MEGUMI, OYAMA TAKAHARU, TAKAMIZU YOSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a polishing composition capable of reducing abrasion resistance applied between a substrate and a polishing pad during polishing while maintaining practical workability when used in polishing of a Ni-P substrate.SOLUTION: A magnetic disk substrate polishing composition having a nickel phosphorous plating layer is provided. This polishing composition contains colloidal silica as abrasive grains, an acid, and water. This polishing composition further contains an additive A. The additive A is a (poly)oxyethylene alkyl ether phosphoric acid having a hydrocarbon group having 4 to 12 carbon atoms and oxyethylene units of 1 or more to 4 or less units. The content of the additive A is less than 0.1 wt.%.SELECTED DRAWING: None 【課題】Ｎｉ－Ｐ基板の研磨に用いられて、実用的な加工性を維持しながら、研磨中に基板と研磨パッドとの間にかかる研磨抵抗を低減することのできる研磨用組成物を提供すること。【解決手段】ニッケルリンめっき層を有する磁気ディスク基板研磨用組成物が提供される。この研磨用組成物は、砥粒としてのコロイダルシリカと、酸と、水とを含む。この研磨用組成物は、さらに添加剤Ａを含む。前記添加剤Ａは、炭素数が４～１２の炭化水素基、および１単位以上４単位以下のオキシエチレン単位を有する（ポリ）オキシエチレンアルキルエーテルリン酸である。そして、前記添加剤Ａの含有量は０．１重量％未満である。【選択図】なし