SUBSTRATE DRYING DEVICE AND SUBSTRATE PROCESSING DEVICE

To provide a substrate drying device and a substrate processing device that can reduce the occurrence of pattern clogging.SOLUTION: In a substrate processing device 1, a drying device (substrate drying device) 300 includes a heating portion 32 that heats a substrate W, a drying chamber 31 into which...

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1. Verfasser: TARUNO YOKO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a substrate drying device and a substrate processing device that can reduce the occurrence of pattern clogging.SOLUTION: In a substrate processing device 1, a drying device (substrate drying device) 300 includes a heating portion 32 that heats a substrate W, a drying chamber 31 into which the substrate W having a liquid film of a processing liquid formed on the surface to be processed is carried, a support portion 34 that receives the substrate W carried into the drying chamber 31 at a standby position D that is separated from the heating portion 32, and a drive mechanism 35 that moves to a drying position U close to the heating portion 32 while rotating the substrate W supported by the support portion 34, and discharges the liquid film provided between the drive mechanism and the substrate W heated by the heating portion 32 and generating an air layer by the centrifugal force caused by the rotation of the substrate W.SELECTED DRAWING: Figure 2 【課題】パターン閉塞の発生を低減できる基板乾燥装置及び基板処理装置を提供する。【解決手段】基板処理装置1において、乾燥装置(基板乾燥装置)300は、基板Wを加熱する加熱部32と、被処理面上に処理液による液膜が形成された状態の基板Wが搬入される乾燥室31と、乾燥室31に搬入された基板Wを、加熱部32から離隔した待機位置Dで受け取る支持部34と、支持部34に支持された基板Wを回転させながら、加熱部32に接近する乾燥位置Uに移動させ、加熱部32により加熱された基板Wとの間に気層が生じた液膜を、基板Wの回転による遠心力により排出させる駆動機構35と、を有する。【選択図】図2