MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

To provide a technique of solving the warpage of a semiconductor substrate, suitable in manufacture of a semiconductor device having a semiconductor element formed on a front surface and having a functional layer also on a back surface.SOLUTION: A manufacturing method disclosed herein includes a dif...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IWAHASHI YOHEI, SHIMONO TAKAYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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