SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
To provide a semiconductor device that suppresses a short between leads.SOLUTION: A metal burrs 3 generated between the leads 2 due to singulation by dicing are cut by providing a resin recess 4 on the surface of a sealing resin 1 between adjacent leads 2 such that the sealing resin 1 is recessed, a...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a semiconductor device that suppresses a short between leads.SOLUTION: A metal burrs 3 generated between the leads 2 due to singulation by dicing are cut by providing a resin recess 4 on the surface of a sealing resin 1 between adjacent leads 2 such that the sealing resin 1 is recessed, and electrical short between the leads 2a and 2b or between the leads 2b and 2c is suppressed.SELECTED DRAWING: Figure 1
【課題】リード間ショートを抑制する半導体装置を提供する。【解決手段】隣接するリード２間の封止樹脂１の表面に、封止樹脂１が窪むように樹脂凹部４を設けることで、ダイシングによる個片化によってリード２間に発生する金属バリ３が分断され、金属バリ起因でリード２ａとリード２ｂの間、あるいは、リード２ｂとリード２ｃの間で電気的にショートすることを抑制する。【選択図】図１ |
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