THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, LAMINATED HEAT-RADIATION SHEET, HEAT-RADIATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE
To provide a thermally conductive resin sheet having excellent voltage resistance and thermal conductivity and also excellent moisture absorption reflow resistance.SOLUTION: A thermally conductive resin composition comprises a thermoplastic resin and a boron nitride floc. When an intra-particle pore...
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| creator | MATSUI JUN EBIYA TOSHIAKI WATANABE NOBU SUZUKI HIDEJI |
| description | To provide a thermally conductive resin sheet having excellent voltage resistance and thermal conductivity and also excellent moisture absorption reflow resistance.SOLUTION: A thermally conductive resin composition comprises a thermoplastic resin and a boron nitride floc. When an intra-particle pore volume of the boron nitride floc, measured by the mercury press-in method, is defined as A1, and the inter-particle gap volume is defined as B1, B1/(A1+B1) is 0.60 or more. The composition can give a thermally conductive resin sheet.SELECTED DRAWING: Figure 6
【課題】耐電圧性能及び熱伝導率が良好であり、吸湿リフロー耐性に優れる熱伝導性樹脂シートを提供する。【解決手段】本発明の一態様に係る熱伝導性樹脂組成物は、熱可塑性樹脂及び窒化ホウ素凝集粒子を含む樹脂組成物であって、水銀圧入法により測定される、前記窒化ホウ素凝集粒子の粒子内細孔容積をＡ１とし、粒子間隙容積をＢ１としたとき、Ｂ１／（Ａ１＋Ｂ１）が０．６０以上であり、この組成物から熱伝導性樹脂シートが得られる。【選択図】図６ |
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【課題】耐電圧性能及び熱伝導率が良好であり、吸湿リフロー耐性に優れる熱伝導性樹脂シートを提供する。【解決手段】本発明の一態様に係る熱伝導性樹脂組成物は、熱可塑性樹脂及び窒化ホウ素凝集粒子を含む樹脂組成物であって、水銀圧入法により測定される、前記窒化ホウ素凝集粒子の粒子内細孔容積をＡ１とし、粒子間隙容積をＢ１としたとき、Ｂ１／（Ａ１＋Ｂ１）が０．６０以上であり、この組成物から熱伝導性樹脂シートが得られる。【選択図】図６</description><language>eng ; jpn</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221006&DB=EPODOC&CC=JP&NR=2022149288A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221006&DB=EPODOC&CC=JP&NR=2022149288A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUI JUN</creatorcontrib><creatorcontrib>EBIYA TOSHIAKI</creatorcontrib><creatorcontrib>WATANABE NOBU</creatorcontrib><creatorcontrib>SUZUKI HIDEJI</creatorcontrib><title>THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, LAMINATED HEAT-RADIATION SHEET, HEAT-RADIATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE</title><description>To provide a thermally conductive resin sheet having excellent voltage resistance and thermal conductivity and also excellent moisture absorption reflow resistance.SOLUTION: A thermally conductive resin composition comprises a thermoplastic resin and a boron nitride floc. When an intra-particle pore volume of the boron nitride floc, measured by the mercury press-in method, is defined as A1, and the inter-particle gap volume is defined as B1, B1/(A1+B1) is 0.60 or more. The composition can give a thermally conductive resin sheet.SELECTED DRAWING: Figure 6
【課題】耐電圧性能及び熱伝導率が良好であり、吸湿リフロー耐性に優れる熱伝導性樹脂シートを提供する。【解決手段】本発明の一態様に係る熱伝導性樹脂組成物は、熱可塑性樹脂及び窒化ホウ素凝集粒子を含む樹脂組成物であって、水銀圧入法により測定される、前記窒化ホウ素凝集粒子の粒子内細孔容積をＡ１とし、粒子間隙容積をＢ１としたとき、Ｂ１／（Ａ１＋Ｂ１）が０．６０以上であり、この組成物から熱伝導性樹脂シートが得られる。【選択図】図６</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwjAURbs4iPoPD-cWtDrU8Zk8yZMmKWlacSpF4iRaqN_kd6pQFwdxunDuudxx9PCKnMY8P4KwRlbCc03gqGTzArqwJXu2JoYfXqmIfAw5ajboSYIi9IlDyfjefvovKtiJij1sLToZAxoJhT2Qg5I0Dx_WgaSaBU2j0bm99GE25CSa78gLlYTu1oS-a0_hGu7NvkgXabpcb9Isw9Vf0hPp_0c-</recordid><startdate>20221006</startdate><enddate>20221006</enddate><creator>MATSUI JUN</creator><creator>EBIYA TOSHIAKI</creator><creator>WATANABE NOBU</creator><creator>SUZUKI HIDEJI</creator><scope>EVB</scope></search><sort><creationdate>20221006</creationdate><title>THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, LAMINATED HEAT-RADIATION SHEET, HEAT-RADIATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE</title><author>MATSUI JUN ; EBIYA TOSHIAKI ; WATANABE NOBU ; SUZUKI HIDEJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022149288A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUI JUN</creatorcontrib><creatorcontrib>EBIYA TOSHIAKI</creatorcontrib><creatorcontrib>WATANABE NOBU</creatorcontrib><creatorcontrib>SUZUKI HIDEJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUI JUN</au><au>EBIYA TOSHIAKI</au><au>WATANABE NOBU</au><au>SUZUKI HIDEJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, LAMINATED HEAT-RADIATION SHEET, HEAT-RADIATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE</title><date>2022-10-06</date><risdate>2022</risdate><abstract>To provide a thermally conductive resin sheet having excellent voltage resistance and thermal conductivity and also excellent moisture absorption reflow resistance.SOLUTION: A thermally conductive resin composition comprises a thermoplastic resin and a boron nitride floc. When an intra-particle pore volume of the boron nitride floc, measured by the mercury press-in method, is defined as A1, and the inter-particle gap volume is defined as B1, B1/(A1+B1) is 0.60 or more. The composition can give a thermally conductive resin sheet.SELECTED DRAWING: Figure 6
【課題】耐電圧性能及び熱伝導率が良好であり、吸湿リフロー耐性に優れる熱伝導性樹脂シートを提供する。【解決手段】本発明の一態様に係る熱伝導性樹脂組成物は、熱可塑性樹脂及び窒化ホウ素凝集粒子を含む樹脂組成物であって、水銀圧入法により測定される、前記窒化ホウ素凝集粒子の粒子内細孔容積をＡ１とし、粒子間隙容積をＢ１としたとき、Ｂ１／（Ａ１＋Ｂ１）が０．６０以上であり、この組成物から熱伝導性樹脂シートが得られる。【選択図】図６</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, LAMINATED HEAT-RADIATION SHEET, HEAT-RADIATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE |
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