THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE RESIN SHEET, LAMINATED HEAT-RADIATION SHEET, HEAT-RADIATION CIRCUIT BOARD, AND POWER SEMICONDUCTOR DEVICE
To provide a thermally conductive resin sheet having excellent voltage resistance and thermal conductivity and also excellent moisture absorption reflow resistance.SOLUTION: A thermally conductive resin composition comprises a thermoplastic resin and a boron nitride floc. When an intra-particle pore...
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Zusammenfassung: | To provide a thermally conductive resin sheet having excellent voltage resistance and thermal conductivity and also excellent moisture absorption reflow resistance.SOLUTION: A thermally conductive resin composition comprises a thermoplastic resin and a boron nitride floc. When an intra-particle pore volume of the boron nitride floc, measured by the mercury press-in method, is defined as A1, and the inter-particle gap volume is defined as B1, B1/(A1+B1) is 0.60 or more. The composition can give a thermally conductive resin sheet.SELECTED DRAWING: Figure 6
【課題】耐電圧性能及び熱伝導率が良好であり、吸湿リフロー耐性に優れる熱伝導性樹脂シートを提供する。【解決手段】本発明の一態様に係る熱伝導性樹脂組成物は、熱可塑性樹脂及び窒化ホウ素凝集粒子を含む樹脂組成物であって、水銀圧入法により測定される、前記窒化ホウ素凝集粒子の粒子内細孔容積をA1とし、粒子間隙容積をB1としたとき、B1/(A1+B1)が0.60以上であり、この組成物から熱伝導性樹脂シートが得られる。【選択図】図6 |
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