THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY

To provide a thermoplastic resin composition for forming a molding having excellent rigidity and heat aging resistance.SOLUTION: Provided is a thermoplastic resin composition that contains a thermoplastic resin (A) having a melt flow rate (230°C, 2.16 kg load) of 1 g/10 minutes or more by 55 to 69 p...

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Hauptverfasser: KONNO YU, KUSHI SATOSHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a thermoplastic resin composition for forming a molding having excellent rigidity and heat aging resistance.SOLUTION: Provided is a thermoplastic resin composition that contains a thermoplastic resin (A) having a melt flow rate (230°C, 2.16 kg load) of 1 g/10 minutes or more by 55 to 69 pts.mass and an inorganic filler (B) by 31 to 45 pts.mass (where the total amount of (A) and (B) is 100 pts.mass), and an antioxidant (C) by 0.38 pts.mass or more, and in which the antioxidant (C) contains a hindered phenol-based antioxidant (C1-1) having neither an ester structure nor an amide structure as a primary antioxidant, and does not contain an antioxidant (C1-2) having an ester structure or an amide structure, or, contains by less than 0.1 pts.mass.SELECTED DRAWING: None 【課題】剛性および耐熱老化性に優れた成形体を形成するための熱可塑性樹脂組成物を提供すること。【解決手段】メルトフローレート(230℃、2.16kg荷重)が1g/10分以上である熱可塑性樹脂(A)を55~69質量部、無機フィラー(B)を31~45質量部(ただし、(A)および(B)の合計量が100質量部)、および酸化防止剤(C)を0.38質量部以上含有し、前記酸化防止剤(C)は、一次酸化防止剤として、エステル構造およびアミド構造のいずれも有さないヒンダードフェノール系酸化防止剤(C1-1)を含有し、かつエステル構造またはアミド構造を有する酸化防止剤(C1-2)を含有しないか、0.1質量部未満含有する熱可塑性樹脂組成物。【選択図】なし