PROCESSING STATE ESTIMATION METHOD AND PROCESSING STATE ESTIMATION SYSTEM

To provide a processing state estimation method and a processing state estimation system that can accurately estimate a processing state.SOLUTION: A processing state estimation system 1 includes an observation device 20 and an estimation arithmetic device 30. The estimation arithmetic device 30 incl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KORENAGA ATSUSHI, MANO DAIKI, HAMADA KENJI, IWAI HIDEKI, WAKAZONO YOSHIO, KON TOMOHIKO
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a processing state estimation method and a processing state estimation system that can accurately estimate a processing state.SOLUTION: A processing state estimation system 1 includes an observation device 20 and an estimation arithmetic device 30. The estimation arithmetic device 30 includes: a signal acquisition unit 31 for acquiring an AE signal S from the observation device 20; a frequency band effective value arithmetic unit 34 for calculating a respective effective value J of a plurality of frequency bands for the AE signal S; and a surface roughness estimation unit 36 for estimating surface roughness as a processing state, on the basis of an interrelation between the effective value J and the processing state.SELECTED DRAWING: Figure 4 【課題】加工状態を精度良く推定することができる加工状態推定方法及び加工状態推定システムを提供すること。【解決手段】加工状態推定システム1は、観測装置20及び推定演算装置30を備える。推定演算装置30は、観測装置20からAE信号Sを取得する信号取得部31と、AE信号Sについて複数の周波数帯域の各々の実効値Jを算出する周波数帯域実効値演算部34と、実効値Jと加工状態との間の相関関係に基づいて、加工状態として表面粗さを推定する表面粗さ推定部36と、を有する。【選択図】図4