MEMORY SYSTEM
To suppress the generation of defects due to an impact and a heat.SOLUTION: A memory system of an embodiment, comprises: a substrate including a core part having a first surface and a second surface, that are opposite each other, a plurality of first and second pad electrodes in which each of them i...
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Sprache: | eng ; jpn |
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Zusammenfassung: | To suppress the generation of defects due to an impact and a heat.SOLUTION: A memory system of an embodiment, comprises: a substrate including a core part having a first surface and a second surface, that are opposite each other, a plurality of first and second pad electrodes in which each of them is provided on a first surface, and a plurality of third and fourth pad electrodes in which each of them is provided onto a second surface; a memory controller containing a plurality of first ball electrodes bonded to the plurality of first pad electrodes; a non-volatile memory containing a plurality of second ball electrodes bonded to the plurality of second pad electrodes; a first component containing a plurality of third ball electrodes bonded to the plurality of third pad electrodes; and a second component containing a plurality of fourth ball electrode bonded to the plurality of fourth pad electrodes. The plurality of first pad electrodes and the plurality of third pad electrodes are provided to a position so as to be symmetric to the core part. The plurality of second pad electrodes and the plurality of fourth pad electrodes are provided to a position so as to be symmetric to the core part.SELECTED DRAWING: Figure 4
【課題】衝撃及び熱による欠陥の発生を抑制する。【解決手段】一実施形態のメモリシステムは、互いに対向する第1面及び第2面を有するコア部と、各々が第1面上に設けられた複数の第1及び第2パッド電極と、各々が第2面上に設けられた複数の第3及び第4パッド電極と、を含む基板と、複数の第1パッド電極にそれぞれ接合された複数の第1ボール電極を含むメモリコントローラと、複数の第2パッド電極にそれぞれ接合された複数の第2ボール電極を含む不揮発性メモリと、複数の第3パッド電極にそれぞれ接合された複数の第3ボール電極を含む第1部品と、複数の第4パッド電極にそれぞれ接合された複数の第4ボール電極を含む第2部品と、を備える。複数の第1パッド電極と、複数の第3パッド電極とは、コア部に関して対称な位置に設けられる。複数の第2パッド電極と、複数の第4パッド電極とは、コア部に関して対称な位置に設けられる。【選択図】図4 |
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