METHOD FOR MANUFACTURING SUBSTRATE WITH CURABLE RESIN COMPOSITION LAYER

To provide a method for manufacturing a substrate with a curable resin composition layer having sufficient film thickness uniformity.SOLUTION: A method for manufacturing a substrate with a curable resin composition layer includes the steps of: coating a curable resin composition containing a curable...

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Bibliographische Detailangaben
1. Verfasser:	NISHIHIRA NARIYOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BLASTING CHEMISTRY COMPOSITIONS BASED THEREON DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM HEATING LIGHTING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MECHANICAL ENGINEERING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	To provide a method for manufacturing a substrate with a curable resin composition layer having sufficient film thickness uniformity.SOLUTION: A method for manufacturing a substrate with a curable resin composition layer includes the steps of: coating a curable resin composition containing a curable resin and a solvent onto a substrate, and forming a coated film containing the curable resin composition on the substrate; and drying the coated film at 80-200°C, wherein solid content concentration of the curable resin composition is 80 wt.% or less, thickness of the coated film is 30-300 μm, and the step of forming the coated film includes applying air to a coated film surface.SELECTED DRAWING: None 【課題】十分な膜厚均一性を有する硬化性樹脂組成物層付き基板の製造方法を提供する。【解決手段】硬化性樹脂と溶剤を含む硬化性樹脂組成物を基板上に塗布し、前記基板上に前記硬化性樹脂組成物を含む塗膜を形成する工程と、前記塗膜を８０℃～２００℃で乾燥させる工程を含み、前記硬化性樹脂組成物の固形分濃度が８０ｗｔ％以下であり、前記塗膜の厚みが３０μｍ～３００μｍであり、前記塗膜を形成する工程において、塗膜面に対して風を当てる、硬化性樹脂組成物層付き基板の製造方法である。【選択図】なし