MANUFACTURING METHOD FOR SUBSTRATE LAMINATE

To provide a manufacturing method for a substrate laminate having an adhesive layer with high adhesion reliability by forming a pattern of a curable resin having a good shape as an adhesive layer.SOLUTION: A manufacturing method for a substrate laminate includes the steps of forming a first pattern...

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Bibliographische Detailangaben
1. Verfasser:	NISHIHIRA NARIYOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a manufacturing method for a substrate laminate having an adhesive layer with high adhesion reliability by forming a pattern of a curable resin having a good shape as an adhesive layer.SOLUTION: A manufacturing method for a substrate laminate includes the steps of forming a first pattern 1 of a curable resin on a first substrate 2 using a printing method, molding the first pattern to form a second pattern 4, and bonding the first substrate and the second substrate together with the second pattern interposed therebetween.SELECTED DRAWING: Figure 2 【課題】接着層として良好な形状を有する硬化性樹脂のパターンを形成することにより、接着信頼性の高い接着層を有する基板積層体の製造方法を提供する。【解決手段】基板積層体の製造方法は、印刷法を用いて第１の基板２上に硬化性樹脂の第１のパターン１を形成する工程と、第１のパターンを型で成型して第２のパターン４を形成する工程と、第２のパターンを介して第１の基板と第２の基板を貼り合わせる工程と、を有する。【選択図】図２