ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION, MOLDED BODY, AND OPTICAL SEMICONDUCTOR DEVICE

To provide an organosilicon compound and a thermosetting resin composition from which a molded body having high light transmittance and gas barrier property can be obtained, and a molded body and an optical semiconductor device obtained using the thermosetting resin composition.SOLUTION: An organosi...

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Hauptverfasser: IKENO HIRONORI, NISHIZAWA KEISUKE, YODA MASAAKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an organosilicon compound and a thermosetting resin composition from which a molded body having high light transmittance and gas barrier property can be obtained, and a molded body and an optical semiconductor device obtained using the thermosetting resin composition.SOLUTION: An organosilicon compound (A1) is represented by formula (1-1). In the formula (1-1), R0 is independently phenyl or a six-membered ring group obtained by subjecting phenyl to nucleus hydrogenation; R1 is independently H or OH; and n is a number satisfying 0≤n≤10 as an average value of the compound.SELECTED DRAWING: None 【課題】高い光透過性とガスバリア性を有する成形体を得ることができる有機ケイ素化合物及び熱硬化性樹脂組成物、並びにこのような熱硬化性樹脂組成物を用いて得られる成形体及び光半導体装置を提供する。【解決手段】式(1-1)で例示される有機ケイ素化合物(A1)による。TIFF2022146347000061.tif54167(式中、R0は独立してフェニル又はフェニルを核水素化した六員環基;R1は独立してH又はOH;nは化合物の平均値として0≦n≦10を満たす数)【選択図】なし