OSCILLATOR PACKAGE, PIEZOELECTRIC OSCILLATOR, AND OSCILLATOR
To achieve more correct frequency shown by a signal output from a terminal for signal output of an oscillator.SOLUTION: An oscillator package includes wiring 60 for piezoelectric vibration piece, which is arranged to cross a border arranged with a piezoelectric vibration piece 3 without overlapping...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To achieve more correct frequency shown by a signal output from a terminal for signal output of an oscillator.SOLUTION: An oscillator package includes wiring 60 for piezoelectric vibration piece, which is arranged to cross a border arranged with a piezoelectric vibration piece 3 without overlapping winding 46 for an external power source and winding 47 for signal output when viewed from the normal direction of a chip mounting side face and connects a first electrode pad 51 with an electrode for chip.SELECTED DRAWING: Figure 6
【課題】発振器の信号出力用端子から出力される信号が示す周波数をより正確なものとする。【解決手段】チップ実装側面の法線方向から見て、外部電源用配線46及び信号出力用配線47と重なることなくかつ圧電振動片3が配置される領域を跨いで配設されると共に、第1電極パッド51とチップ用電極とを接続する圧電振動片用配線60を備える。【選択図】図6 |
---|