SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

To provide a technique which enables more uniform processing of a substrate while enhancing throughput of the processing.SOLUTION: A substrate processing method comprises a holding step S1, a plasma source arrangement step, an atmosphere replacement step S2, an interval reduction step S4, and a plas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIDE MOTOI, SHIBATA SHUICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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