CERAMIC ELECTRONIC COMPONENT, MOUNTING SUBSTRATE, AND MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT

To enable a reduction in height while suppressing a decrease in bending strength, and to prevent solder wetting on an element body.SOLUTION: A ceramic electronic component according to an embodiment includes an element body having a dielectric and an internal electrode, an external electrode including a base layer formed on the end surface of the element body from which the internal electrode is drawn and a surface perpendicular to the end surface, connected to the internal electrode, and containing a metal, and a plating layer formed on the base layer on the side perpendicular to the end face, and an oxide layer having a region in which the thickness at the position away from the end surface of the element body is thinner than the thickness at the position near the end surface of the element body on the surface facing the surface on which the plating layer is formed from among the surfaces perpendicular to the end surface.SELECTED DRAWING: Figure 1 【課題】抗折強度の低下を抑制しつつ、低背化を可能とするとともに、素体上へのはんだの濡れ上がりを防止する。【解決手段】一態様に係るセラミック電子部品によれば、誘電体と内部電極とを有する素体と、前記内部電極が引き出される前記素体の端面および前記端面に垂直な面に形成され前記内部電極と接続し金属を含む下地層と、前記端面に垂直な面側の前記下地層上に形成されためっき層とを有する外部電極と、前記端面に垂直な面のうち、前記めっき層が形成された面と対向する面上において、前記素体の端面から離れた位置の厚みの方が前記素体の端面に近い位置の厚みより薄い領域を有する酸化物層とを備える。【選択図】 図１