LASER SOLDERING APPARATUS

To provide a laser soldering apparatus which can detect the temperature in a portion where the heat resistance is low in the vicinity of a soldering portion and can perform temperature control with the detection temperature as one parameter.SOLUTION: A laser soldering apparatus 1 according to the present invention comprises at least: a laser beam irradiation device 12 which emits a laser beam to a prescribed soldering portion 73; a temperature detection device 20 which detects the temperature of the soldering portion 73; an imaging device 30 which captures an image of the periphery of the soldering portion; a vicinity temperature detection device 21 which detects the temperature of an electronic component 71 in the vicinity of soldering; and a control device which controls the laser beam irradiation device 12 such that the detection temperature detected by the vicinity temperature detection device 21 does not become equal to or greater than the temperature prescribed in the electronic component 71.SELECTED DRAWING: Figure 1 【課題】 本発明は、半田付け箇所の近傍にある熱耐性が低い箇所の温度を検出し、この検出温度を一つのパラメータとして温度制御を行うことができるレーザ半田付け装置を提供する。【解決手段】 本発明のレーザ半田付け装置１は、所定の半田付け箇所７３にレーザ光を照射するレーザ光照射装置１２と、前記半田付け箇所７３の温度を検出する温度検出装置２０と、前記半付け箇所周縁の映像を撮影する撮影装置３０とによって少なくとも構成され、前記半田付け近傍の電子部品７１の温度を検出する近傍温度検出装置２１と、該近傍温度検出装置２１によって検出された検出温度が、電子部品７１に規定される温度以上とならないように、前記レーザ光照射装置１２を制御する制御装置とを具備する。【選択図】 図１