WIRING BOARD

To provide other technologies for suppressing the generation or propagation of cracks in an oxide film layer on a wiring board having a base material made of a metallic material mainly composed of aluminum and an oxide film layer formed on the surface of the base material.SOLUTION: A wiring board has a base material made of a metal material mainly composed of aluminum (Al), an oxide film layer that is an anodic oxide film of the metal material and is formed on the surface of the base material, and a wiring portion having conductivity and formed on the oxide film layer, the oxide film layer has a first oxide film portion on which the wiring portion is formed and a second oxide film portion formed at a distance from the first oxide film portion and on which no wiring portion is formed, and the base material surface is exposed between the first oxide film portion and the second oxide film portion.SELECTED DRAWING: Figure 1 【課題】アルミニウムを主成分とする金属材料から成る基材と、基材表面上に形成された酸化被膜層を有する配線基板において、酸化被膜層のクラックの発生または進展を抑制する他の技術を提供する。【解決手段】配線基板は、アルミニウム（Ａｌ）を主成分とする金属材料から成る基材と、金属材料の陽極酸化被膜であり、基材表面上に形成された酸化被膜層と、導電性を有し、酸化被膜層の上に形成された配線部と、を備え、酸化被膜層は、配線部が形成された第１酸化被膜部と、第１酸化被膜部と離間して形成され、配線部が形成されていない第２酸化被膜部と、を有し、第１酸化被膜部と第２酸化被膜部との間は、基材表面が露出している。【選択図】図１