INSPECTION METHOD AND DEVICE OF SEMICONDUCTOR CHIP

To provide an inspection method and device of a semiconductor chip, which can increase detection accuracy of a crack defect existing inside the chip.SOLUTION: In an inspection method of a semiconductor chip, a camera 11 is provided in a direction oblique to a semiconductor chip 2 as an inspection ob...

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Hauptverfasser:	SUZUKI YASUYOSHI, KOKAJI MINEYUKI, SUGANO JUNICHI, YAJIMA KOICHI, KAWABATA TETSUO, MATSUMOTO NAOMORI, NASU YUICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	To provide an inspection method and device of a semiconductor chip, which can increase detection accuracy of a crack defect existing inside the chip.SOLUTION: In an inspection method of a semiconductor chip, a camera 11 is provided in a direction oblique to a semiconductor chip 2 as an inspection object and a near-infrared light source 12 is provided in a regular reflection direction relative to an optical axis of the camera 11. The camera 11 takes a near-infrared image of the semiconductor chip 2 while the near-infrared light source 12 applies near-infrared light toward the semiconductor chip 2, so that a crack defect existing inside the semiconductor chip 2 is inspected by processing the near-infrared image.SELECTED DRAWING: Figure 1 【課題】チップ内部に存在するクラック欠陥の検出精度を高めることが可能な半導体チップの検査方法及び装置を提供する。【解決手段】本発明による半導体チップの検査方法は、検査対象の半導体チップ２に対して斜め方向にカメラ１１を設置すると共に、カメラ１１の光軸に対して正反射方向に近赤外光源１２を設置し、近赤外光源１２から半導体チップ２に向けて近赤外光を照射しながらカメラ１１で半導体チップ２の近赤外光画像を撮影し、近赤外光画像を処理して半導体チップ２の内部に存在するクラック欠陥を検査する。【選択図】図１