CONDUCTOR JOINT STRUCTURE AND CONDUCTOR ULTRASONIC JOINT METHOD

To provide a conductor joint structure and a conductor ultrasonic joint method which enable efficient joint of conductors by ultrasonic joint.SOLUTION: A conductor ultrasonic joint device 1 has an anvil 7, a horn 5 arranged so as to face the anvil 7, and a vibration source 3 which is connected to one end of the horn 5 and imparts vibration to the horn 5. A vertical direction of an aggregation of the conductor 15 is sandwiched between the anvil 7 and the horn 5, and a width direction thereof is sandwiched between a pair of gathers 9. Ultrasonic vibration is imparted to the aggregate through the horn 5 from the vibration source 3 while sandwiching the aggregate between the anvil 7 and the horn 5 from the vertical direction and collectively pressurizing the aggregate in a state where the width direction of the aggregate is sandwiched between the gathers 9 and is restricted. At this time, a height of the anvil 7 on a side distant from the vibration source 3 is set to be higher than a height of the anvil 7 on a side close to the vibration source 3.SELECTED DRAWING: Figure 3 【課題】 超音波接合によって効率良く導体同士を接合することが可能な導体の接合構造および導体の超音波接合方法を提供する。【解決手段】 超音波接合装置１は、アンビル７と、アンビル７と対向配置されるホーン５と、ホーン５の一端に接続され、ホーン５に振動を与える振動源３とを有する。導体１５の集合体は、上下方向をアンビル７とホーン５とで挟まれ、幅方向を一対のギャザー９で挟まれる。集合体の幅方向をギャザー９で挟み込んで規制した状態で、上下方向からアンビル７とホーン５とで集合体を挟んで一括して加圧しながら、振動源３からホーン５を介して集合体に超音波振動を与える。この際、振動源３から遠い側のアンビル７の高さが、振動源３に近い側のアンビル７の高さよりも高くなるように設定される。【選択図】図３