HOT PRESS MOLDING DIE AND METHOD FOR PRODUCTION THEREOF

To provide a hot press molding die capable of easily and reliably closing a passage hole in a die main body with a plug member.SOLUTION: A hot press molding die comprises a die main body 12 formed of a die material for hot press molding, and a cooling structure 14 having a refrigerant passage 26 for...

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Bibliographische Detailangaben
Hauptverfasser:	IIZUKA KENICHI, YOKOTA AKIHIRO, ITOI HIROKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BLASTING CYLINDERS ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PISTONS PUNCHING METAL SEALINGS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	To provide a hot press molding die capable of easily and reliably closing a passage hole in a die main body with a plug member.SOLUTION: A hot press molding die comprises a die main body 12 formed of a die material for hot press molding, and a cooling structure 14 having a refrigerant passage 26 formed inside the die main body 12. The cooling passage 26 includes first to fifth passage holes 21 to 25 being open on exterior surfaces of the die main body 12 (flanks 12a, 12b and bottom face 12c). Openings 22a to 24a of the second to fourth passage holes 22 to 24 are closed by first to third plug members 31 to 33. The first to third plug members 31 to 33 are formed by pins that fits into the openings 22a to 24a in a press fitting state.SELECTED DRAWING: Figure 1 【課題】金型本体の通路孔を栓部材で簡単にかつ確実に閉塞することが可能な熱間プレス成型用金型を提供する。【解決手段】熱間プレス成型用の金型材料によって形成された金型本体１２を備える。金型本体１２の内部に形成された冷媒通路２６を有する冷却構造１４を備える。冷媒通路２６は、金型本体１２の外面（側面１２ａ，１２ｂ、底面１２ｃ）に開口する第１～第５の通路孔２１～２５を含む。第２～第４の通路孔２２～２４の開口部２２ａ～２４ａは、第１～第３の栓部材３１～３３によって閉塞される。第１～第３の栓部材３１～３３は、開口部２２ａ～２４ａに圧入状態で嵌合するピンによって形成されている。【選択図】図１