FILM DEPOSITION DEVICE, FILM DEPOSITION METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

To improve the accuracy of film deposition in a film deposition device that controls film deposition operation on the basis of measurements on the amount of release of a vapor-deposition material.SOLUTION: A film deposition device forms a film by depositing a vapor-deposition material on a substrate...

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Hauptverfasser: WATABE ARATA, OGATA TOSHIHIRO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To improve the accuracy of film deposition in a film deposition device that controls film deposition operation on the basis of measurements on the amount of release of a vapor-deposition material.SOLUTION: A film deposition device forms a film by depositing a vapor-deposition material on a substrate. The film deposition device has: monitoring means that measures the amount of the vapor-deposition material released from an evaporation source; and film-thickness measuring means that measures the thickness of the vapor-deposition material on the substrate. The film deposition operation controlled on the basis of the amount of release measured by the monitoring means is calibrated on the basis of the thickness measured by the film-thickness measuring means.SELECTED DRAWING: Figure 9 【課題】蒸着材料の放出量の測定値に基づき成膜動作を制御する成膜装置において成膜の精度を向上させる。【解決手段】基板に蒸着材料を蒸着して成膜を行う成膜装置であって、蒸着材料を放出する蒸発源からの蒸着材料の放出量を測定するモニタ手段と、基板における蒸着材料の膜厚を測定する膜厚測定手段と、を備え、モニタ手段による放出量の測定値に基づいて制御されている成膜動作を、膜厚測定手段による膜厚の測定値に基づいて較正することを特徴とする成膜装置を用いる。【選択図】図9