METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS WITH REGENERATED METAL ELECTRODE TERMINAL SURFACE
To provide a method for manufacturing electronic components that can be reused for industrial applications by effectively removing oxide films from the surface of terminals by improving formic acid reduction for electronic components whose metal electrode terminal surfaces have been substantially ox...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide a method for manufacturing electronic components that can be reused for industrial applications by effectively removing oxide films from the surface of terminals by improving formic acid reduction for electronic components whose metal electrode terminal surfaces have been substantially oxidized due to long-term aging and deterioration.SOLUTION: The electronic component is an electronic component that is three years old after manufacture, has a terminal 20 to be soldered to a substrate 9, the terminals are plated with metal for solder joints, and the terminal surface is regenerated by performing a treatment to remove the metal oxide film, and the treatment of the method for manufacturing electronic components includes formic acid reduction heat treatment of the metal oxide film. The formic acid reduction heat treatment is performed from the reaction start temperature of formic acid reduction to below the melting point of the metal.SELECTED DRAWING: Figure 2
【課題】長期の経年劣化によって金属電極端子の表面が可成り酸化された電子部品について、ギ酸還元を改良することによって、端子表面から酸化膜を効果的に除き、工業用途に再利用可能な電子部品を製造する方法を提供する。【解決手段】電子部品は、製造後3年を経過した電子部品であり、基板9にはんだ接合される端子20を有し、端子にははんだ接合用の金属がメッキされてなり、金属の酸化膜を除くための処理を実行することによって、端子表面が再生された電子部品の製造方法であって、処理は、金属酸化膜のギ酸還元熱処理を含む。ギ酸還元熱処理は、ギ酸還元の反応開始温度から金属の融点以下で実行する。【選択図】図2 |
---|