ETCHING METHOD AND ETCHING APPARATUS

To selectively etch a desired film from among a plurality of types of films formed on the surface of a substrate.SOLUTION: An etching method includes the steps of: supplying a protective film forming gas including at least one of a compound including a hydroxyl group and water to a substrate having...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UMEMOTO MANAMI, KANEKI TOSHIKI, TAKAHASHI NOBUHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!