HEAT SINK CASE, PRINTED CIRCUIT BOARD AND SUBSTRATE STRUCTURE

To provide a heat sink case that can suppress electromagnetic radiation from a heat sink with a simple configuration when a heat sink is mounted on a printed wiring board.SOLUTION: A heat sink case covering electronic components mounted on a printed circuit board has a top plate part of a conductive body covering the electronic components, and a plurality of finger parts of a conductive body contacting a peripheral edge of the top plate part and projecting in a direction intersecting the top plate part and surrounding the electronic components. Each of the finger components has a spring portion provided at one end with a conductive portion contacting the top plate part and extending in a direction intersecting the conductive portion, and a clamping portion provided at the other end of the spring portion and clamping each of the plurality of jumper components of the conductive body fixed to the printed circuit board to surround the electronic component.SELECTED DRAWING: Figure 4 【課題】プリント配線板に放熱器を搭載する際、簡素な構成で放熱器からの電磁波放射を抑制できるヒートシンクケースを提供する。【解決手段】プリント回路板に搭載された電子部品を覆うヒートシンクケースは、電子部品を覆う伝導体の天板部品と、天板部品の周縁部に接触し且つ電子部品を囲み天板部品と交叉する方向に突出する伝導体の複数のフィンガ部品と、を有する。フィンガ部品の各々は、天板部品に接触する導通部を一端に備えかつ導通部と交叉する方向に延在するバネ部と、バネ部の他端に備えられかつ電子部品を囲むようにプリント回路板に固定された伝導体の複数のジャンパ部品の各々を挟む挟持部と、を有する。【選択図】図４