POLYAMIDE-IMIDE

To provide a polyamide-imide (PAI) capable of obtaining a polyamide-imide film having both high elastic modulus and high elongation when molding into a film shape.SOLUTION: A polyamide-imide (PAI) is a polyamide-imide (PAI) using trimellitic anhydride (TMA) as an acid constituent, o-tolidinediisocya...

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Hauptverfasser:	YOSHINO FUMIKO, SHIBATA KENTA, MORIKITA TATSUYA, ECHIGO YOSHIAKI, YAMADA MUNENORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a polyamide-imide (PAI) capable of obtaining a polyamide-imide film having both high elastic modulus and high elongation when molding into a film shape.SOLUTION: A polyamide-imide (PAI) is a polyamide-imide (PAI) using trimellitic anhydride (TMA) as an acid constituent, o-tolidinediisocyanate (TODI) as an isocyanate constituent, and dimer diamine (DDA) as a diamine constituent, where the tensile strength is 60% or more, and the tensile elastic modulus is 4.5 GPa or more when turned into a film.SELECTED DRAWING: None 【課題】フィルム状に成形した時、高い弾性率と高い伸度とが両立したポリアミドイミド（ＰＡＩ）フィルムを得ることできるポリアミドイミド（ＰＡＩ）の提供。【解決手段】酸成分として無水トリメリット酸（ＴＭＡ）、イソシアネート成分としてｏ－トリジンジイソシアネート（ＴＯＤＩ）、ジアミン成分としてダイマジアミン（ＤＤＡ）を用いたポリアミドイミド（ＰＡＩ）であって、フィルムとした時の引張伸度が６０％以上、引張弾性率が４．５ＧＰａ以上であることを特徴とするポリアミドイミド（ＰＡＩ）。【選択図】なし