HIGH-FREQUENCY CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

To provide a high-frequency circuit board that prevents cracks from occurring in the board at the edge of a wiring layer, prevents the wiring layer from peeling off from the board, and contributes to improved reliability, and a manufacturing method of the high-frequency circuit board.SOLUTION: A high-frequency circuit board 1A includes a substrate 2 made of a material containing a dielectric or a semiconductor and having a first coefficient of linear expansion, a first wiring layer 3 having an edge portion 3E and formed on a first surface 2F of the substrate 2, and a first spacer 4 located in a region 3R not straddling the edge portion 3E of the first wiring layer 3 and having a second coefficient of linear expansion larger than the first coefficient of linear expansion.SELECTED DRAWING: Figure 1 【課題】配線層の縁部において基板にクラックが発生することを防止し、基板から配線層が剥離することを防止し、信頼性の向上に寄与する高周波回路基板と、この高周波回路基板を製造する製造方法とを提供する。【解決手段】高周波回路基板１Ａは、誘電体又は半導体を含む材料で構成され、第１線膨張率を有する基板２と、縁部３Ｅを有するとともに基板２の第１面２Ｆ上に形成された第１配線層３と、第１配線層３の縁部３Ｅを跨がない領域３Ｒに位置し、前記第１線膨張率よりも大きい第２線膨張率を有する第１スペーサ４と、を備える。【選択図】図１