SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

To shorten a time required for preheating before film formation while suppressing substrate warpage.SOLUTION: A substrate processing method according to the present disclosure includes a preparation step of placing a substrate to be processed on a mounting table in a processing container, a first heating step of supplying first gas into the processing container and heating the substrate to be processed by heating means, a second heating step of stopping the supply of the first gas and supplying second gas different from the first gas to heat the substrate to be processed by the heating means, and a processing step of supplying third gas containing the second gas to process the substrate to be processed.SELECTED DRAWING: Figure 3 【課題】基板反りを抑制しながら、成膜前の予備加熱に要する時間を短縮すること。【解決手段】本開示は、処理容器内の載置台に被処理基板を載置する準備工程と、第１のガスを前記処理容器内に供給して加熱手段で前記被処理基板を加熱する第１の加熱工程と、前記第１のガスの供給を停止して、前記第１のガスとは異なる第２のガスを供給して前記加熱手段で前記被処理基板を加熱する第２の加熱工程と、前記第２のガスを含む第３のガスを供給して前記被処理基板を処理する処理工程と、を有する基板処理方法を提供する。【選択図】図３