CHIP PEELING METHOD, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND CHIP PEELING DEVICE
To prevent cracking on an outer circumferential side of a chip in an initial peeling process where the outer circumferential side of the chip is to be peeled off from an adhesive sheet.SOLUTION: A chip peeling method is for peeling a chip 11 from an adhesive sheet 12 to which a chip 11 is attached o...
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| Sprache: | eng ; jpn |
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| Zusammenfassung: | To prevent cracking on an outer circumferential side of a chip in an initial peeling process where the outer circumferential side of the chip is to be peeled off from an adhesive sheet.SOLUTION: A chip peeling method is for peeling a chip 11 from an adhesive sheet 12 to which a chip 11 is attached on a top surface. After arranging the adhesive sheet 12 to which the chip 11 is attached so that an outer circumferential side of the chip 11 to be peeled is arranged in a location corresponding to a space portion A between a base stage 16 and a movable stage 17, by moving at least one of the base stage 16 and the movable stage 17 in a direction to narrow the space portion A in a state where the space portion A is set to a negative pressure so that the adhesive sheet 12 is suctioned, the outer circumferential side of the chip 11 is peeled off from the adhesive sheet 12.SELECTED DRAWING: Figure 6
【課題】本発明では、チップの外周端側を粘着シートから剥離させる初期剥離において、チップの外周端側に生じる割れを防止することを課題とする。【解決手段】上面にチップ１１を貼り付けた粘着シート１２からチップ１１を剥離させるチップ剥離方法であって、剥離するチップ１１の外周端側が基台ステージ１６と可動ステージ１７との間の空間部Ａに対応する位置に配置されるように、チップ１１を貼り付けた粘着シート１２を配置した後、空間部Ａを負圧にして粘着シート１２を吸引した状態で、基台ステージ１６と可動ステージ１７との少なくとも一方を、空間部Ａを狭める方向へ移動させることで、チップ１１の外周端側を粘着シート１２から剥離させることを特徴とする。【選択図】図６ |
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