PRODUCTION METHOD OF Li-DOPED p-TYPE NiO THIN FILM

To provide a production method of a Li-doped p-type NiO thin film capable of obtaining a Li-doped p-type NiO thin film having low resistance.SOLUTION: In a production method of a Li-doped p-type NiO thin film, in which a LI-doped polycrystalline p-type NiO thin film (as-grown thin film) is deposited...

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description To provide a production method of a Li-doped p-type NiO thin film capable of obtaining a Li-doped p-type NiO thin film having low resistance.SOLUTION: In a production method of a Li-doped p-type NiO thin film, in which a LI-doped polycrystalline p-type NiO thin film (as-grown thin film) is deposited by a vapor phase epitaxial method, and the obtained polycrystalline p-type NiO thin film (as-grown thin film) is annealed, a film-forming temperature of the polycrystalline p-type NiO thin film (as-grown thin film), and an annealing temperature thereafter are set in a specific range respectively. To put it concretely, deposition is carried out at 100°C or lower, and annealing is carried out at a temperature of 100-300°C.SELECTED DRAWING: Figure 1 【課題】低抵抗のLiドープp型NiO薄膜を得ることのできるLiドープp型NiO薄膜の製造方法を提供する。【解決手段】気相成長法によりLiがドープされた多結晶p型NiO薄膜(as-grown薄膜)を成膜し、得られた多結晶p型NiO薄膜(as-grown薄膜)をアニールする、Liドープp型NiO薄膜の製造方法において、多結晶p型NiO薄膜(as-grown薄膜)の成膜温度と、その後のアニール温度とを、特定の範囲とする。具体的には、成膜を100℃以下の温度で実施し、アニールを100~300℃の温度で実施する。【選択図】図1
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To put it concretely, deposition is carried out at 100°C or lower, and annealing is carried out at a temperature of 100-300°C.SELECTED DRAWING: Figure 1 【課題】低抵抗のLiドープp型NiO薄膜を得ることのできるLiドープp型NiO薄膜の製造方法を提供する。【解決手段】気相成長法によりLiがドープされた多結晶p型NiO薄膜(as-grown薄膜)を成膜し、得られた多結晶p型NiO薄膜(as-grown薄膜)をアニールする、Liドープp型NiO薄膜の製造方法において、多結晶p型NiO薄膜(as-grown薄膜)の成膜温度と、その後のアニール温度とを、特定の範囲とする。具体的には、成膜を100℃以下の温度で実施し、アニールを100~300℃の温度で実施する。【選択図】図1</description><language>eng ; jpn</language><subject>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE ; APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CRYSTAL GROWTH ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE ; REFINING BY ZONE-MELTING OF MATERIAL ; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE ; SINGLE-CRYSTAL-GROWTH ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220815&amp;DB=EPODOC&amp;CC=JP&amp;NR=2022118459A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220815&amp;DB=EPODOC&amp;CC=JP&amp;NR=2022118459A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWATARI MIKIHISA</creatorcontrib><title>PRODUCTION METHOD OF Li-DOPED p-TYPE NiO THIN FILM</title><description>To provide a production method of a Li-doped p-type NiO thin film capable of obtaining a Li-doped p-type NiO thin film having low resistance.SOLUTION: In a production method of a Li-doped p-type NiO thin film, in which a LI-doped polycrystalline p-type NiO thin film (as-grown thin film) is deposited by a vapor phase epitaxial method, and the obtained polycrystalline p-type NiO thin film (as-grown thin film) is annealed, a film-forming temperature of the polycrystalline p-type NiO thin film (as-grown thin film), and an annealing temperature thereafter are set in a specific range respectively. To put it concretely, deposition is carried out at 100°C or lower, and annealing is carried out at a temperature of 100-300°C.SELECTED DRAWING: Figure 1 【課題】低抵抗のLiドープp型NiO薄膜を得ることのできるLiドープp型NiO薄膜の製造方法を提供する。【解決手段】気相成長法によりLiがドープされた多結晶p型NiO薄膜(as-grown薄膜)を成膜し、得られた多結晶p型NiO薄膜(as-grown薄膜)をアニールする、Liドープp型NiO薄膜の製造方法において、多結晶p型NiO薄膜(as-grown薄膜)の成膜温度と、その後のアニール温度とを、特定の範囲とする。具体的には、成膜を100℃以下の温度で実施し、アニールを100~300℃の温度で実施する。【選択図】図1</description><subject>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE</subject><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CRYSTAL GROWTH</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</subject><subject>REFINING BY ZONE-MELTING OF MATERIAL</subject><subject>SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</subject><subject>SINGLE-CRYSTAL-GROWTH</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKCPJ3CXUO8fT3U_B1DfHwd1Hwd1PwydR18Q9wdVEo0A2JDHBV8Mv0Vwjx8PRTcPP08eVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRkaGhhYmppaOxkQpAgDSjCdc</recordid><startdate>20220815</startdate><enddate>20220815</enddate><creator>KAWATARI MIKIHISA</creator><scope>EVB</scope></search><sort><creationdate>20220815</creationdate><title>PRODUCTION METHOD OF Li-DOPED p-TYPE NiO THIN FILM</title><author>KAWATARI MIKIHISA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022118459A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE</topic><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CRYSTAL GROWTH</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</topic><topic>REFINING BY ZONE-MELTING OF MATERIAL</topic><topic>SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE</topic><topic>SINGLE-CRYSTAL-GROWTH</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWATARI MIKIHISA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWATARI MIKIHISA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRODUCTION METHOD OF Li-DOPED p-TYPE NiO THIN FILM</title><date>2022-08-15</date><risdate>2022</risdate><abstract>To provide a production method of a Li-doped p-type NiO thin film capable of obtaining a Li-doped p-type NiO thin film having low resistance.SOLUTION: In a production method of a Li-doped p-type NiO thin film, in which a LI-doped polycrystalline p-type NiO thin film (as-grown thin film) is deposited by a vapor phase epitaxial method, and the obtained polycrystalline p-type NiO thin film (as-grown thin film) is annealed, a film-forming temperature of the polycrystalline p-type NiO thin film (as-grown thin film), and an annealing temperature thereafter are set in a specific range respectively. To put it concretely, deposition is carried out at 100°C or lower, and annealing is carried out at a temperature of 100-300°C.SELECTED DRAWING: Figure 1 【課題】低抵抗のLiドープp型NiO薄膜を得ることのできるLiドープp型NiO薄膜の製造方法を提供する。【解決手段】気相成長法によりLiがドープされた多結晶p型NiO薄膜(as-grown薄膜)を成膜し、得られた多結晶p型NiO薄膜(as-grown薄膜)をアニールする、Liドープp型NiO薄膜の製造方法において、多結晶p型NiO薄膜(as-grown薄膜)の成膜温度と、その後のアニール温度とを、特定の範囲とする。具体的には、成膜を100℃以下の温度で実施し、アニールを100~300℃の温度で実施する。【選択図】図1</abstract><oa>free_for_read</oa></addata></record>
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subjects AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE
APPARATUS THEREFOR
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
CRYSTAL GROWTH
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
REFINING BY ZONE-MELTING OF MATERIAL
SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
SINGLE-CRYSTAL-GROWTH
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
title PRODUCTION METHOD OF Li-DOPED p-TYPE NiO THIN FILM
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