MULTI-PARTICLE BEAM MICROSCOPY AND RELATED METHODS WITH IMPROVED FOCUS SETTING CONSIDERING IMAGE PLANE TILT

To provide an improved multi-particle beam system that inspects a semiconductor wafer having an HV structure and related methods of operating the same.SOLUTION: The present invention relates to a multi-particle beam microscopy and related methods for setting an optimal focal plane at an optical reso...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MICHAEL BEHNKE, DIRK ZEIDLER, NICOLE RAUWOLF, MULLER INGO, CHRISTOPH RIEDESEL, NICO KAEMMER, GUNTHER SCHEUNERT, ARNE THOMA
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide an improved multi-particle beam system that inspects a semiconductor wafer having an HV structure and related methods of operating the same.SOLUTION: The present invention relates to a multi-particle beam microscopy and related methods for setting an optimal focal plane at an optical resolution and setting telecentric illumination with a plurality of primary beams. A method is proposed to determine an optimal setting plane on which an object surface is mounted. In addition, means is proposed to facilitate resolution enhancement and telecentric illumination for the plurality of primary beams. The means includes means for selecting and individually influencing individual primary beams as targeted and/or for influencing the plurality of primary beams collectively.SELECTED DRAWING: Figure 5 【課題】HV構造を有する半導体ウェーハを検査する改良型の多粒子ビームシステム及びそれを操作する関連の方法を提供する。【解決手段】多粒子ビーム顕微鏡と、ある光学分解能で最適な焦点面を設定し且つ複数の一次ビームでテレセントリック照射を設定する関連の方法とに関する。物体表面を置く最適設定面を決定する方法が提案される。さらに、多数の一次ビームについて分解能の向上及びテレセントリック照射を容易にする手段が提案される。この手段は、個別一次ビームを目標通りに選択して目標通りに個別に影響を及ぼすこと及び/又は複数の一次ビームに一括して影響を及ぼす手段を含む。【選択図】図5