BUMP FORMATION DEVICE, BUMP FORMATION METHOD, SOLDER BALL REPAIR DEVICE, AND SOLDER BALL REPAIR METHOD

To provide soldering device and method that have high credibility in ultra minute solder formation.SOLUTION: A bump formation device supplies a solder ball 24 onto an electrode pad formed on a substrate 21. The bump formation device comprises: a plasma generator which irradiates the fed solder ball...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUTORI RYOSUKE, KAIZU TAKUYA, FUJISE KAZUHIRO, MIZUKOSHI TAICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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