BUMP FORMATION DEVICE, BUMP FORMATION METHOD, SOLDER BALL REPAIR DEVICE, AND SOLDER BALL REPAIR METHOD
To provide soldering device and method that have high credibility in ultra minute solder formation.SOLUTION: A bump formation device supplies a solder ball 24 onto an electrode pad formed on a substrate 21. The bump formation device comprises: a plasma generator which irradiates the fed solder ball...
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| creator | MIZUTORI RYOSUKE KAIZU TAKUYA FUJISE KAZUHIRO MIZUKOSHI TAICHI |
| description | To provide soldering device and method that have high credibility in ultra minute solder formation.SOLUTION: A bump formation device supplies a solder ball 24 onto an electrode pad formed on a substrate 21. The bump formation device comprises: a plasma generator which irradiates the fed solder ball 24 with plasma, and removes an oxide film of the solder ball 24; and a laser generator 305 which irradiates the solder ball 24 with laser, and melts the solder ball 24. This device removes the oxide film of the solder ball 24 by plasma irradiation means, and simultaneously, melts the solder ball 24 by laser irradiation means 305, and forms solder bump on the electrode pad.SELECTED DRAWING: Figure 17
【課題】本発明は、極微細はんだバンプ形成において、信頼性の高いはんだ付け装置及び方法を提供する。【解決手段】本発明のバンプ形成装置は、基板２１上に形成された電極パッド上に、ハンダボール２４を供給するバンプ形成装置であって、供給されたハンダボール２４にプラズマを照射し、ハンダボール２４の酸化膜を除去するプラズマ発生装置と、ハンダボール２４にレーザーを照射し、ハンダボール２４を溶融するレーザー発生装置３０５と、を備え、プラズマ照射手段によりハンダボール２４の酸化膜を除去すると同時に、レーザー照射手段３０５によりハンダボール２４を溶融し、電極パッドにハンダバンプを形成することを特徴とする。【選択図】図１７ |
| format | Patent |
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【課題】本発明は、極微細はんだバンプ形成において、信頼性の高いはんだ付け装置及び方法を提供する。【解決手段】本発明のバンプ形成装置は、基板２１上に形成された電極パッド上に、ハンダボール２４を供給するバンプ形成装置であって、供給されたハンダボール２４にプラズマを照射し、ハンダボール２４の酸化膜を除去するプラズマ発生装置と、ハンダボール２４にレーザーを照射し、ハンダボール２４を溶融するレーザー発生装置３０５と、を備え、プラズマ照射手段によりハンダボール２４の酸化膜を除去すると同時に、レーザー照射手段３０５によりハンダボール２４を溶融し、電極パッドにハンダバンプを形成することを特徴とする。【選択図】図１７</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220808&DB=EPODOC&CC=JP&NR=2022114729A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220808&DB=EPODOC&CC=JP&NR=2022114729A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIZUTORI RYOSUKE</creatorcontrib><creatorcontrib>KAIZU TAKUYA</creatorcontrib><creatorcontrib>FUJISE KAZUHIRO</creatorcontrib><creatorcontrib>MIZUKOSHI TAICHI</creatorcontrib><title>BUMP FORMATION DEVICE, BUMP FORMATION METHOD, SOLDER BALL REPAIR DEVICE, AND SOLDER BALL REPAIR METHOD</title><description>To provide soldering device and method that have high credibility in ultra minute solder formation.SOLUTION: A bump formation device supplies a solder ball 24 onto an electrode pad formed on a substrate 21. The bump formation device comprises: a plasma generator which irradiates the fed solder ball 24 with plasma, and removes an oxide film of the solder ball 24; and a laser generator 305 which irradiates the solder ball 24 with laser, and melts the solder ball 24. This device removes the oxide film of the solder ball 24 by plasma irradiation means, and simultaneously, melts the solder ball 24 by laser irradiation means 305, and forms solder bump on the electrode pad.SELECTED DRAWING: Figure 17
【課題】本発明は、極微細はんだバンプ形成において、信頼性の高いはんだ付け装置及び方法を提供する。【解決手段】本発明のバンプ形成装置は、基板２１上に形成された電極パッド上に、ハンダボール２４を供給するバンプ形成装置であって、供給されたハンダボール２４にプラズマを照射し、ハンダボール２４の酸化膜を除去するプラズマ発生装置と、ハンダボール２４にレーザーを照射し、ハンダボール２４を溶融するレーザー発生装置３０５と、を備え、プラズマ照射手段によりハンダボール２４の酸化膜を除去すると同時に、レーザー照射手段３０５によりハンダボール２４を溶融し、電極パッドにハンダバンプを形成することを特徴とする。【選択図】図１７</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEhzCvUNUHDzD_J1DPH091NwcQ3zdHbVUUAT9nUN8fB30VEI9vdxcQ1ScHL08VEIcg1w9AyC63D0c8EmDdHJw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDIyMDA1NzI0sHY2JUgQAxo40yg</recordid><startdate>20220808</startdate><enddate>20220808</enddate><creator>MIZUTORI RYOSUKE</creator><creator>KAIZU TAKUYA</creator><creator>FUJISE KAZUHIRO</creator><creator>MIZUKOSHI TAICHI</creator><scope>EVB</scope></search><sort><creationdate>20220808</creationdate><title>BUMP FORMATION DEVICE, BUMP FORMATION METHOD, SOLDER BALL REPAIR DEVICE, AND SOLDER BALL REPAIR METHOD</title><author>MIZUTORI RYOSUKE ; KAIZU TAKUYA ; FUJISE KAZUHIRO ; MIZUKOSHI TAICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022114729A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MIZUTORI RYOSUKE</creatorcontrib><creatorcontrib>KAIZU TAKUYA</creatorcontrib><creatorcontrib>FUJISE KAZUHIRO</creatorcontrib><creatorcontrib>MIZUKOSHI TAICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIZUTORI RYOSUKE</au><au>KAIZU TAKUYA</au><au>FUJISE KAZUHIRO</au><au>MIZUKOSHI TAICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BUMP FORMATION DEVICE, BUMP FORMATION METHOD, SOLDER BALL REPAIR DEVICE, AND SOLDER BALL REPAIR METHOD</title><date>2022-08-08</date><risdate>2022</risdate><abstract>To provide soldering device and method that have high credibility in ultra minute solder formation.SOLUTION: A bump formation device supplies a solder ball 24 onto an electrode pad formed on a substrate 21. The bump formation device comprises: a plasma generator which irradiates the fed solder ball 24 with plasma, and removes an oxide film of the solder ball 24; and a laser generator 305 which irradiates the solder ball 24 with laser, and melts the solder ball 24. This device removes the oxide film of the solder ball 24 by plasma irradiation means, and simultaneously, melts the solder ball 24 by laser irradiation means 305, and forms solder bump on the electrode pad.SELECTED DRAWING: Figure 17
【課題】本発明は、極微細はんだバンプ形成において、信頼性の高いはんだ付け装置及び方法を提供する。【解決手段】本発明のバンプ形成装置は、基板２１上に形成された電極パッド上に、ハンダボール２４を供給するバンプ形成装置であって、供給されたハンダボール２４にプラズマを照射し、ハンダボール２４の酸化膜を除去するプラズマ発生装置と、ハンダボール２４にレーザーを照射し、ハンダボール２４を溶融するレーザー発生装置３０５と、を備え、プラズマ照射手段によりハンダボール２４の酸化膜を除去すると同時に、レーザー照射手段３０５によりハンダボール２４を溶融し、電極パッドにハンダバンプを形成することを特徴とする。【選択図】図１７</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | BUMP FORMATION DEVICE, BUMP FORMATION METHOD, SOLDER BALL REPAIR DEVICE, AND SOLDER BALL REPAIR METHOD |
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