POWER MODULE

To improve the operation reliability of a power module.SOLUTION: A power module 1 comprises a driving circuit 2 operative in response to a control signal S1, a first output end 4 connected to the driving circuit 2 via a driving resistance 3, a first reference potential end 5, a drive substrate 6 to mount the driving circuit 2, the first output end 4, and the first reference potential end 5, a semiconductor mounting part 8 to mount a power semiconductor element 7, a heat dissipation substrate 11 to mount a control connection part 9 and a first reference connection part 10, and a radiator 12. The driving substrate 6 has a first output conductor layer 17 connected to the first output end 4 and a first reference potential layer 18 connected to the first reference potential end 5, the first reference potential layer 18 includes a plurality of layers, which sandwiches the first output conductor layer 17 in an insulated state to be arranged and laminated, the first output end 4 and the control connection part 9 are connected by a first rod-like conductor 19, and the first reference potential end 5 and the first reference connection part 10 are connected by a second rod-like conductor 20.SELECTED DRAWING: Figure 1 【課題】パワーモジュールの動作信頼性の向上を図る。【解決手段】パワーモジュール１は、制御信号Ｓ１に応じて動作する駆動回路２と、駆動回路２に駆動抵抗３を介して接続された第１出力端４と、第１基準電位端５と、駆動回路２と第１出力端４と第１基準電位端５とが配置される駆動基板６と、パワー半導体素子７が実装される半導体実装部８と、制御接続部９と、第１基準接続部１０とが配置される放熱基板１１と、冷却器１２とを含む。駆動基板６は、第１出力端４に接続された第１出力導体層１７と、第１基準電位端５に接続された第１基準電位層１８とを有し、第１基準電位層１８は複数層で設けられて第１出力導体層１７を絶縁状態で挟持して積層配置され、第１出力端４と制御接続部９とは第１棒状導体１９で接続され、第１基準電位端５と第１基準接続部１０とは第２棒状導体２０で接続されている。【選択図】図１