PRINTED WIRING BOARD

To provide a technique capable of suppressing the occurrence of fracture at a joint with a solder bump and a conductor pad.SOLUTION: A printed wiring board includes a base insulating layer made of an insulating material, a conductor layer formed on the base insulating layer and including a conductor...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ONO MOTOMICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a technique capable of suppressing the occurrence of fracture at a joint with a solder bump and a conductor pad.SOLUTION: A printed wiring board includes a base insulating layer made of an insulating material, a conductor layer formed on the base insulating layer and including a conductor pad, a solder resist layer formed on the base insulating layer and the conductor layer and having an opening for exposing the conductor pad, and a solder bump formed on the exposed conductor pad and having a first portion filling the opening and a second portion projecting above the opening. The opening area of the opening increases from the upper surface of the solder resist layer toward the upper surface of the conductor pad.SELECTED DRAWING: Figure 1 【課題】はんだバンプと導体パッドとの接合部における破断の発生を抑制することができる技術を開示する。【解決手段】プリント配線板は、絶縁材料からなる基部絶縁層と、前記基部絶縁層上に形成され、導体パッドを含む導体層と、前記基部絶縁層及び前記導体層上に形成され、前記導体パッドを露出させる開口部を有するソルダーレジスト層と、露出された前記導体パッド上に形成されるとともに、前記開口部内に充填される第１部分と、前記開口部よりも上方に突出する第２部分とを有するはんだバンプと、を備える。前記開口部の開口面積は、前記ソルダーレジスト層の上面から前記導体パッドの上面に向けて大きくなる。【選択図】図１