PHOTOSENSITIVE LAMINATED RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT
To provide a photosensitive laminated resin structure that causes few scratch marks and has high heat-dissipating properties but yet offers high resolution, and the like.SOLUTION: The photosensitive laminated resin structure includes a heat radiation layer (A) and a protective layer (B). The heat ra...
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| creator | OKAMOTO DAICHI MIYABE HIDEKAZU |
| description | To provide a photosensitive laminated resin structure that causes few scratch marks and has high heat-dissipating properties but yet offers high resolution, and the like.SOLUTION: The photosensitive laminated resin structure includes a heat radiation layer (A) and a protective layer (B). The heat radiation layer (A) contains a heat-radiating filler with a thermal conductivity of higher than 10 W/m K, with the content of the heat-radiating filler being 50 mass% or more in all the components excluding an organic solvent. In the protective layer (B), the content of the heat-radiating filler is 0-20 mass% of the content of the heat-radiating filler in the heat radiation layer (A).SELECTED DRAWING: Figure 1
【課題】スクラッチ痕が発生しにくく、高放熱性でありながら、高解像性が得られる感光性積層樹脂構造体等を提供する。【解決手段】放熱層（Ａ）と、保護層（Ｂ）とを有する感光性積層樹脂構造体であって、前記放熱層（Ａ）は、熱伝導率が１０Ｗ／ｍ・Ｋよりも高い放熱性フィラーを含有し、かつ前記放熱性フィラーの含有率が、有機溶剤を除く全成分中に５０質量％以上であり、前記保護層（Ｂ）は、前記放熱性フィラーの含有率が、前記放熱層（Ａ）の前記放熱性フィラーの含有率の０～２０質量％であることを特徴とする感光性積層樹脂構造体等である。【選択図】図１ |
| format | Patent |
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【課題】スクラッチ痕が発生しにくく、高放熱性でありながら、高解像性が得られる感光性積層樹脂構造体等を提供する。【解決手段】放熱層（Ａ）と、保護層（Ｂ）とを有する感光性積層樹脂構造体であって、前記放熱層（Ａ）は、熱伝導率が１０Ｗ／ｍ・Ｋよりも高い放熱性フィラーを含有し、かつ前記放熱性フィラーの含有率が、有機溶剤を除く全成分中に５０質量％以上であり、前記保護層（Ｂ）は、前記放熱性フィラーの含有率が、前記放熱層（Ａ）の前記放熱性フィラーの含有率の０～２０質量％であることを特徴とする感光性積層樹脂構造体等である。【選択図】図１</description><language>eng ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220729&DB=EPODOC&CC=JP&NR=2022110455A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220729&DB=EPODOC&CC=JP&NR=2022110455A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMOTO DAICHI</creatorcontrib><creatorcontrib>MIYABE HIDEKAZU</creatorcontrib><title>PHOTOSENSITIVE LAMINATED RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT</title><description>To provide a photosensitive laminated resin structure that causes few scratch marks and has high heat-dissipating properties but yet offers high resolution, and the like.SOLUTION: The photosensitive laminated resin structure includes a heat radiation layer (A) and a protective layer (B). The heat radiation layer (A) contains a heat-radiating filler with a thermal conductivity of higher than 10 W/m K, with the content of the heat-radiating filler being 50 mass% or more in all the components excluding an organic solvent. In the protective layer (B), the content of the heat-radiating filler is 0-20 mass% of the content of the heat-radiating filler in the heat radiation layer (A).SELECTED DRAWING: Figure 1
【課題】スクラッチ痕が発生しにくく、高放熱性でありながら、高解像性が得られる感光性積層樹脂構造体等を提供する。【解決手段】放熱層（Ａ）と、保護層（Ｂ）とを有する感光性積層樹脂構造体であって、前記放熱層（Ａ）は、熱伝導率が１０Ｗ／ｍ・Ｋよりも高い放熱性フィラーを含有し、かつ前記放熱性フィラーの含有率が、有機溶剤を除く全成分中に５０質量％以上であり、前記保護層（Ｂ）は、前記放熱性フィラーの含有率が、前記放熱層（Ａ）の前記放熱性フィラーの含有率の０～２０質量％であることを特徴とする感光性積層樹脂構造体等である。【選択図】図１</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOofFs8V2mgfEJItjTSbkGwFvZQi8SRaqP_HHnyAp2GYWYtbaD37hJQs2wtCp5wlxWggYrIEiWOvuY9YgIlXaGznCtCLGwjRm6WBIgPYoeboyWrQ3gVPSLwVq8f4nPPux43YN8i6PeTpPeR5Gu_5lT_DOchSyqoqT3Wtjn9NX-lQMnc</recordid><startdate>20220729</startdate><enddate>20220729</enddate><creator>OKAMOTO DAICHI</creator><creator>MIYABE HIDEKAZU</creator><scope>EVB</scope></search><sort><creationdate>20220729</creationdate><title>PHOTOSENSITIVE LAMINATED RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT</title><author>OKAMOTO DAICHI ; MIYABE HIDEKAZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2022110455A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2022</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAMOTO DAICHI</creatorcontrib><creatorcontrib>MIYABE HIDEKAZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAMOTO DAICHI</au><au>MIYABE HIDEKAZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE LAMINATED RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT</title><date>2022-07-29</date><risdate>2022</risdate><abstract>To provide a photosensitive laminated resin structure that causes few scratch marks and has high heat-dissipating properties but yet offers high resolution, and the like.SOLUTION: The photosensitive laminated resin structure includes a heat radiation layer (A) and a protective layer (B). The heat radiation layer (A) contains a heat-radiating filler with a thermal conductivity of higher than 10 W/m K, with the content of the heat-radiating filler being 50 mass% or more in all the components excluding an organic solvent. In the protective layer (B), the content of the heat-radiating filler is 0-20 mass% of the content of the heat-radiating filler in the heat radiation layer (A).SELECTED DRAWING: Figure 1
【課題】スクラッチ痕が発生しにくく、高放熱性でありながら、高解像性が得られる感光性積層樹脂構造体等を提供する。【解決手段】放熱層（Ａ）と、保護層（Ｂ）とを有する感光性積層樹脂構造体であって、前記放熱層（Ａ）は、熱伝導率が１０Ｗ／ｍ・Ｋよりも高い放熱性フィラーを含有し、かつ前記放熱性フィラーの含有率が、有機溶剤を除く全成分中に５０質量％以上であり、前記保護層（Ｂ）は、前記放熱性フィラーの含有率が、前記放熱層（Ａ）の前記放熱性フィラーの含有率の０～２０質量％であることを特徴とする感光性積層樹脂構造体等である。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS TRANSPORTING |
| title | PHOTOSENSITIVE LAMINATED RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT |
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