PHOTOSENSITIVE LAMINATED RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT

To provide a photosensitive laminated resin structure that causes few scratch marks and has high heat-dissipating properties but yet offers high resolution, and the like.SOLUTION: The photosensitive laminated resin structure includes a heat radiation layer (A) and a protective layer (B). The heat ra...

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Bibliographische Detailangaben
Hauptverfasser: OKAMOTO DAICHI, MIYABE HIDEKAZU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a photosensitive laminated resin structure that causes few scratch marks and has high heat-dissipating properties but yet offers high resolution, and the like.SOLUTION: The photosensitive laminated resin structure includes a heat radiation layer (A) and a protective layer (B). The heat radiation layer (A) contains a heat-radiating filler with a thermal conductivity of higher than 10 W/m K, with the content of the heat-radiating filler being 50 mass% or more in all the components excluding an organic solvent. In the protective layer (B), the content of the heat-radiating filler is 0-20 mass% of the content of the heat-radiating filler in the heat radiation layer (A).SELECTED DRAWING: Figure 1 【課題】スクラッチ痕が発生しにくく、高放熱性でありながら、高解像性が得られる感光性積層樹脂構造体等を提供する。【解決手段】放熱層(A)と、保護層(B)とを有する感光性積層樹脂構造体であって、前記放熱層(A)は、熱伝導率が10W/m・Kよりも高い放熱性フィラーを含有し、かつ前記放熱性フィラーの含有率が、有機溶剤を除く全成分中に50質量%以上であり、前記保護層(B)は、前記放熱性フィラーの含有率が、前記放熱層(A)の前記放熱性フィラーの含有率の0~20質量%であることを特徴とする感光性積層樹脂構造体等である。【選択図】図1