INDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF

To provide an inductor component which can be easily manufactured.SOLUTION: An inductor component 10 comprises: an insulating substrate 1 including a first principal surface 1a and a second principal surface 1b; one or more first wiring layers 2 extending along the first principal surface 1a at the...

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Bibliographische Detailangaben
Hauptverfasser: FUMIYA MASARU, NUKAGA OSAMU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an inductor component which can be easily manufactured.SOLUTION: An inductor component 10 comprises: an insulating substrate 1 including a first principal surface 1a and a second principal surface 1b; one or more first wiring layers 2 extending along the first principal surface 1a at the side of the first principal surface 1a; one or more second wiring layers 4 extending along the second principal surface 1b at the side of the second principal surface 1b; and a plurality of penetrating wires 3 and 5 penetrating the substrate 1. The first wiring layers 2, the first penetrating wire 3, the second wiring layers 4 and the second penetrating wire 5 are connected in this order. The first wiring layers 2, the first penetrating wire 3, the second wiring layers 4 and the second penetrating wire 5 form a spiral structure repeating a structure in which they are moved forward while circulating around an axis along the first principal surface 1a.SELECTED DRAWING: Figure 1 【課題】容易に製造することができるインダクタ部品を提供する。【解決手段】インダクタ部品10は、第1主面1aおよび第2主面1bを有する絶縁性の基材1と、第1主面1a側に第1主面1aに沿って延在する1または複数の第1の配線層2と、第2主面1b側に第2主面1bに沿って延在する1または複数の第2の配線層4と、基材1を貫通する複数の貫通配線3,5と、を備える。第1の配線層2と、第1の貫通配線3と、第2の配線層4と、第2の貫通配線5とは、この順に接続される。第1の配線層2と、第1の貫通配線3と、第2の配線層4と、第2の貫通配線5とは、第1主面1aに沿う軸の周りを周回しつつ前進する構造が繰り返された螺旋構造をなす。【選択図】図1