METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

To provide a method for producing a thermosetting resin composition which allows an inorganic filler to be highly loaded.SOLUTION: In the method for producing a thermosetting resin composition, a mixture obtained by mixing a thermosetting resin, a curing agent, and a slurry containing an inorganic f...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAURA ITARU, KANG DONGOL, HONG CHANG XUN, NOZAWA HIROSHI, HIRASHIMA KATSUSHI, NAKAMURA TAKEHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a method for producing a thermosetting resin composition which allows an inorganic filler to be highly loaded.SOLUTION: In the method for producing a thermosetting resin composition, a mixture obtained by mixing a thermosetting resin, a curing agent, and a slurry containing an inorganic filler and a solvent is kneaded while removing the solvent. The proportion of a solvent having a boiling point of 50-180°C in all solvents contained in the mixture is 95 mass% or more.SELECTED DRAWING: None 【課題】無機充填材の高充填化が可能な熱硬化性樹脂組成物の製造方法を提供すること。【解決手段】熱硬化性樹脂組成物の製造方法は、熱硬化性樹脂と、硬化剤と、無機充填材と溶剤とを含むスラリーと、を混合した混合物を、前記溶剤を除去しながら混練するものであり、前記混合物に含まれる全溶剤に占める、沸点が５０℃～１８０℃の溶剤の割合が、９５質量％以上である。【選択図】なし