METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

To provide a method for producing a thermosetting resin composition applicable even to a low-temperature curable composition and capable of maintaining good fluidity and curability, a thermosetting resin composition obtained by the production method, an electronic component device including an element sealed with the thermosetting resin composition, and a method for manufacturing the same.SOLUTION: The method for producing a thermosetting resin composition includes: primary kneading in which a mixture of a thermosetting resin and an inorganic filler is kneaded in a kneader; cooling of the mixture after the primary kneading; and secondary kneading in which a curing accelerator is added to the mixture after the cooling and the mixture is further kneaded. The temperature of the secondary kneading is lower than an onset temperature measured by differential scanning calorimetry of the mixture after the addition of the curing accelerator in the secondary kneading.SELECTED DRAWING: None 【課題】低温硬化性の組成にも適用可能であり、良好な流動性及び硬化性を維持することができる熱硬化性樹脂組成物の製造方法、当該製造方法により得られる熱硬化性樹脂組成物、並びに当該熱硬化性樹脂組成物により封止された素子を備える電子部品装置及びその製造方法を提供する。【解決手段】熱硬化性樹脂組成物の製造方法は、熱硬化性樹脂と無機充填材の混合物を混練機中で混練する一次混練と、前記一次混練の後の前記混合物の冷却と、前記冷却後の前記混合物に硬化促進剤を添加してさらに混練する二次混練と、を含み、前記二次混練の温度が、前記二次混練において前記硬化促進剤を添加した後の混合物の、示差走査熱量測定により測定されるオンセット温度より低い。【選択図】なし