LASER PROCESSING APPARATUS

To provide a laser processing apparatus capable of preventing degradation in printing quality without adjusting a scan speed of a scanner.SOLUTION: A laser processing apparatus 100 includes an oscillator 20, a scanner 30, a control device 50, and an input device 60. The oscillator 20 repeatedly gene...

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Bibliographische Detailangaben
Hauptverfasser:	SAKAMOTO TATSUNORI, YOKOI TADAMASA, TSUCHIMICHI KAZUMI, YOSHITAKE NAOKI, ASHIHARA KATSUMITSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a laser processing apparatus capable of preventing degradation in printing quality without adjusting a scan speed of a scanner.SOLUTION: A laser processing apparatus 100 includes an oscillator 20, a scanner 30, a control device 50, and an input device 60. The oscillator 20 repeatedly generates a pulse train including a plurality of optical pulses. The control device 50 changes at least one of the number of optical pulses and a pulse width of each of the plurality of optical pulses in a predetermined region where a speed of scanning changes when a laser beam is scanned by the scanner 30 along a processing pattern received by the input device 60.SELECTED DRAWING: Figure 2 【課題】スキャナの走査速度を調整せずとも、印字品質が低下することを防ぐことができるレーザ加工装置を提供する。【解決手段】レーザ加工装置１００は、発振器２０と、スキャナ３０と、制御装置５０と、入力装置６０と、を備える。発振器２０は、複数の光パルスを含むパルス列を繰り返し発生させる。制御装置５０は、入力装置６０で受け付けた加工パターンに沿ってスキャナ３０でレーザ光を走査する場合に、走査する速度が変化する所定領域において、光パルスの数と、複数の光パルスの各々のパルス幅と、の少なくとも一方を可変させる。【選択図】図２