SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

To provide a substrate processing apparatus and a substrate processing method that efficiently process substrates.SOLUTION: The present invention provides a substrate processing apparatus. In one embodiment, the substrate processing apparatus includes a support member that supports a substrate and is rotatably provided, a processing liquid nozzle that selectively supplies a hot first processing liquid and a hot second processing liquid to the substrate, and a controller that controls the processing liquid nozzle to supply the first processing liquid first to the substrate and then supply the second processing liquid to the substrate.SELECTED DRAWING: Figure 5 【課題】基板を効率的に処理する基板処理装置及び基板処理方法を提供する。【解決手段】本発明は基板を処理する装置を提供する。一実施形態において、基板処理装置は、基板を支持し、回転可能に提供される支持部材と、高温の第１処理液及び高温の第２処理液を選択的に前記基板に供給する処理液ノズルと、前記処理液ノズルが前記第１処理液を前記基板に先に供給した後、前記第２処理液を前記基板に供給するように前記処理液ノズルを制御する制御器と、を含む。【選択図】図５