SEMICONDUCTOR MODULE

To provide a semiconductor module capable of maintaining heat dissipation property by preventing the heat dissipation property from being reduced by a secular change.SOLUTION: A semiconductor module comprises: a plurality of semiconductor chips; a module substrate on which the plurality of semiconductor chips are mounted; a heat sink on which the module substrate is mounted; and a filler filling a gap between the module substrate and the heat sink. The module substrate includes a radiator plate, and an insulation substrate which is provided on the radiator plate and on which the plurality of semiconductor chips are mounted. The radiator plate includes a plurality of recesses and at least one groove which are provided on a face opposed to the heat sink. The plurality of recesses are provided in a region corresponding to a lower side of a region where the plurality of semiconductor chips are disposed. The at least one groove is provided in a region corresponding to a lower side of a region between at least one of the plurality of semiconductor chips and the adjacent other semiconductor chip, and the filler also fills the plurality of recesses.SELECTED DRAWING: Figure 1 【課題】経時変化による放熱性の低下を抑制し、放熱性を維持できる半導体モジュールを提供する。【解決手段】複数の半導体チップと、複数の半導体チップを搭載するモジュール基板と、モジュール基板を搭載するヒートシンクと、モジュール基板とヒートシンクとの間に充填された充填材とを備え、モジュール基板が、放熱板と、放熱板上に設けられ、複数の半導体チップを搭載する絶縁基板とを有し、放熱板は、ヒートシンクと対向する面に設けられた複数の凹部および少なくとも１つの溝部を有し、複数の凹部は、複数の半導体チップの配設領域の下方に対応する領域に設けられ、少なくとも１つの溝部は、複数の半導体チップのうち少なくとも１つと、隣り合った他の半導体チップとの間の領域の下方に対応する領域に設けられ、充填材は、複数の凹部にも充填される。【選択図】図１