POLISHING HEAD AND POLISHING DEVICE

To efficiently cool a polishing head against heat generated during polishing.SOLUTION: A polishing head 200 for polishing a substrate 110 held with a polished surface up comprises: a shaft 240; a flange 210 fixed to the shaft 240; and a plurality of fins 280 provided on the surface other than the su...

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Bibliographische Detailangaben
Hauptverfasser: KOBAYASHI KENICHI, FURUSAWA MANATO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To efficiently cool a polishing head against heat generated during polishing.SOLUTION: A polishing head 200 for polishing a substrate 110 held with a polished surface up comprises: a shaft 240; a flange 210 fixed to the shaft 240; and a plurality of fins 280 provided on the surface other than the surface of the flange 210 to which a polishing pad 500 pressed to the polished surface by the shaft 240 is fitted.SELECTED DRAWING: Figure 3 【課題】研磨時に発生する熱に対して研磨ヘッドを効率よく冷却する。【解決手段】被研磨面を上向きにした状態で保持された基板110を研磨するための研磨ヘッド200は、シャフト240と、シャフト240に固定されたフランジ210と、シャフト240によって被研磨面に押圧される研磨パッド500が取り付けられるフランジ210の面以外の面に設けられた複数のフィン280と、を備える。【選択図】図3