ELECTROLESS PLATING APPARATUS

To provide an electroless plating apparatus capable of forming a uniform high-quality nickel plating on a surface to be plated of a semiconductor wafer while aiming for reductions in cost and environmental burden.SOLUTION: An electroless plating apparatus includes a plating tank, a reverse tank, holding means for holding multiple semiconductor wafers by erecting them at constant intervals, a circulation route for a plating liquid, a circulation pump, a flow meter, and a plating liquid supplying pipe having multiple injection ports formed on its upper part at constant intervals. The constant intervals at which multiple semiconductor wafers held by the holding means are erected and the constant intervals at which multiple injection ports are formed on the upper part of the plating liquid supplying pipe are the same intervals. When the holding means is arranged on the upper part of the plating liquid supplying pipe that is arranged on a lowermost part of the plating tank, multiple injection ports formed on the upper part of the plating liquid supplying pipe are positioned at the constant intervals of multiple semiconductor wafers held by the holding means.SELECTED DRAWING: Figure 4 【課題】コスト削減や環境負荷を配慮しつつ、半導体ウェハのめっき面に均一に高品質なニッケルめっきを形成することができる無電解めっき装置を提供する。【解決手段】めっき槽と、リザーブ槽と、複数の半導体ウェハを一定間隔で立設して保持する保持手段と、めっき液の循環路と、循環ポンプと、流量計と、複数の噴出口が一定間隔で上部に形成されためっき液供給パイプと、を備えた無電解めっき装置において、保持手段で保持する複数の半導体ウェハを立設する一定間隔と、めっき液供給パイプの上部に形成される複数の噴出口の一定間隔とは同間隔とし、めっき槽の最下部に設置されためっき液供給パイプの上部に保持手段を設置する際に、保持手段に保持された複数の半導体ウェハの一定間隔間に、当該めっき液供給パイプの上部に形成された複数の噴出口が位置するように配設した無電解めっき装置。【選択図】図４