THERMOSETTING RESIN COMPOSITION

To provide a thermosetting resin composition which has good adhesion to both various resin base materials such as polyimide and LCP and metal base materials, and is excellent in heat resistance, electric characteristics (dielectric characteristics), bending resistance and moisture absorption characteristics.SOLUTION: A thermosetting resin composition (Z) contains acid-modified polyolefin (X) and an oxazoline group-containing compound (Y), in which the acid-modified polyolefin (X) contains polyolefin (A) and an unsaturated carboxylic acid (B) as components, a weight ratio [ethylene/α-olefin having 3 to 8 carbon atoms] of ethylene as a constituent monomer of the polyolefin (A) to α-olefin having 3 to 8 carbon atoms is 2/98 to 50/50, and the acid-modified polyolefin (X) satisfies the following requirements (1) to (3). (1) An acid value is 1-200 mgKOH/g. (2) A number average molecular weight (Mn) is 1,000-60,000. (3) An isotacticity of an α-olefin part is 1-50%.SELECTED DRAWING: None 【課題】ポリイミド及びＬＣＰなどの様々な樹脂基材と金属基材双方への良好な接着性を有し、且つ耐熱性、電気特性（誘電特性）、耐屈曲性及び吸湿特性に優れた熱硬化性樹脂組成物を提供することを目的とする。【解決手段】酸変性ポリオレフィン（Ｘ）及びオキサゾリン基含有化合物（Ｙ）を含有する熱硬化性樹脂組成物であって、酸変性ポリオレフィン（Ｘ）が、ポリオレフィン（Ａ）と不飽和カルボン酸（Ｂ）とを構成原料として含み、ポリオレフィン（Ａ）の構成単量体であるエチレンと炭素数３～８のα－オレフィンとの重量比［エチレン／炭素数３～８のα－オレフィン］が２／９８～５０／５０であり、酸変性ポリオレフィン（Ｘ）が下記要件（１）～（３）のいずれも満たす熱硬化性樹脂組成物（Ｚ）。（１）酸価が１～２００ｍｇＫＯＨ／ｇ（２）数平均分子量（Ｍｎ）が１，０００～６０，０００（３）α－オレフィン部分のアイソタクティシティーが１～５０％【選択図】なし